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科研机构
华南理工大学 [12]
内容类型
会议 [12]
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Performance analysis of pre-oxidation process direct bonding copper substrate (CPCI-S收录)
会议
作者:
Ning, Honglong[1,2,5]
;
Hu, Shiben[1,2]
;
Tao, Ruiqiang[1,2]
;
Liu, Xianzhe[1,2]
;
Zeng, Yong[1,2]
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/04/11
pre-oxidation process
direct bonding copper
dielectric dissipation
relative dielectric constant
electronic speckle pattern interferometer
Research on Combustion Heat Release Rate Testing Technology Based on TDLAS (CPCI-S收录)
会议
作者:
Liu, Jian-yong[1,2,3]
;
Zhao, Xia[1,2]
;
Gao, Shi-jie[1,2]
;
Ma, Xiao-qian[3]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
TDLAS
Paramagnetic
Heat Release Rate
Combustion
Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple (CPCI-S收录)
会议
作者:
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/04/11
3D packaging
fine pitch TSV
micro heater
thermocouple
quality evaluation
Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening (CPCI-S收录)
会议
作者:
Guan, Yong[1]
;
Zeng, Qinghua[1]
;
Chen, Jing[1]
;
Ma, Shenglin[2]
;
Jin, Yufeng[3]
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/04/11
TSV
3D packaging
sidewall insulation
electrical properties
CMP
Tetrahedral Framework registration algorithm for the robot-assisted surgical navigation system (CPCI-S收录)
会议
作者:
Zhu, Jiebao[2]
;
Sun, Yu[1]
;
Gao, Peng[3,4,5]
;
Ma, Kailin[6]
;
Hu, Ying[3,4,5]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
surgical robot
registration algorithm
image navigation
tetrahedral framework
error analysis
Interposer Fabrication with Annular Copper TSV and Multi-layered Redistribution Layer (CPCI-S收录)
会议
作者:
Guan, Yong[1]
;
Ma, Shenglin[2]
;
Zeng, Qinghua[1]
;
Meng, Wei[1,3]
;
Chen, Jing[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
Fabrication and Filling Quality Optimization of the High Density and Small Size Through Silicon Via Array for Three-dimensional Packaging (CPCI-S收录)
会议
作者:
Guan, Yong[1]
;
Zeng, Qinghua[1]
;
Chen, Jing[1]
;
Ma, Shenglin[2]
;
Meng, Wei[3]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
through silicon via
packaging
electroplating
additives
Design and Characterization of Petaloid Hollow Cu Interconnection for Interposer (CPCI-S收录)
会议
作者:
Xia, Yanming[1]
;
Ren, Kuili[1]
;
Ma, Shenglin[1]
;
Guan, Yong[2]
;
Cai, Han[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
petaloid hollow Cu interconnection
3D TSV interposer
thermal-mechanical simulation
influence on electrical property
Research on Combustion Heat Release Rate Testing Technology Based on TDLAS (EI收录)
会议
Guangzhou, China,
作者:
Liu, Jian-Yong[1,2,3]
;
Zhao, Xia[1,2]
;
Gao, Shi-Jie[1,2]
;
Ma, Xiao-Qian[3]
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/04/11
Combustion
Fire extinguishers
Fires
Oxygen
Paramagnetism
Testing
Parametric Study of DRIE Process for Enhancing the Profile-preserving Property of Square Through Silicon Via (CPCI-S收录)
会议
作者:
Guan, Yong[1]
;
Zeng, Qinghua[1]
;
Chen, Jing[1]
;
Ma, Shenglin[2]
;
Meng, Wei[3]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
through silicon via
3D packaging
DRJE
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