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A study on the oxygen plasma treatment on the peel adhesion strength and solder wettability of SnBi58 based anisotropic conductive films 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Zhang, Shuye;  Huang, Mingliang;  Wu, Yang;  Yang, Ming;  Lin, Tiesong
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
Effects of electromigration on microstructural evolution and mechanical properties of preferential growth intermetallic compound interconnects for 3D packaging 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Zou, Lin
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Analysis of socio-economic driving forces of cultivated land area and its forecast in the upstream of Han River of China 会议论文
2018 International Conference on Civil and Hydraulic Engineering, IConCHE 2018, Qingdao, China, 2018-11-23
作者:  Wei, Xiu;  Liu, Dengfeng;  Liu, Hui;  Li, Mingliang;  Lin, Mu
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/20
Face recognition based on deep aggregated sparse autoencoder network 会议论文
37th Chinese Control Conference, CCC 2018, July 25, 2018 - July 27, 2018
作者:  Zou, Guofeng;  Lin, Dingyi;  Fu, Gui-Xia;  Shen, Jin;  Gao, Mingliang
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/31
Face recognition based on deep aggregated sparse autoencoder network 会议论文
37th Chinese Control Conference (CCC), JUL 25-27, 2018
作者:  Zou, Guofeng;  Lin, Dingyi;  Fu, Gui-xia;  Shen, Jin;  Gao, Mingliang
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/31
The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Li, Shuang;  Du, Yao;  Qu, Lin;  Kunwar, Anil;  Sun, Junhao
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
The nucleation of Ag3Sn and the growth orientation relationships with Cu6Sn5 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:  Qu, Lin;  Ma, Haitao;  Zhao, Huijing;  Zhao, Ning;  Kunwar, Anil
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/11
The Effect of Laser-soldering Parameters on the Sn-Ag-Cu/Cu Interfacial Reaction 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:  An, Lili;  Ma, Haitao;  Qu, Lin;  Wang, Jie;  Liu, Jiahui
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/11
西藏拔拉扎矿床特征及矿床成因机制 会议论文
昆明, 2011年12月8日
作者:  王强;  孙燕;  张林;  张世铭;  何佳乐
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/09
Wetland-a hub for microplastic transmission in the global ecosystem 会议论文
Resources, Conservation and Recycling, 153-154, 2019
作者:  Haoyu Liu;  Lin Tang;  Yani Liu;  Guangming Zeng;  Yue Lu
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/13

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