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	Effects of electromigration on microstructural evolution and mechanical properties of preferential growth intermetallic compound interconnects for 3D packaging
	Huang, Mingliang L.; Zou, Lin
	2019
会议名称	69th IEEE Electronic Components and Technology Conference, ECTC 2019
会议日期	2019-05-28
会议地点	Las Vegas, NV, United states
页码	1774-1781
会议录	69th IEEE Electronic Components and Technology Conference, ECTC 2019
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/3227904
专题	大连理工大学
作者单位	Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian, 116024, China
推荐引用方式 GB/T 7714	Huang, Mingliang L.,Zou, Lin. Effects of electromigration on microstructural evolution and mechanical properties of preferential growth intermetallic compound interconnects for 3D packaging[C]. 见:69th IEEE Electronic Components and Technology Conference, ECTC 2019. Las Vegas, NV, United states. 2019-05-28.

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