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	The Effect of Laser-soldering Parameters on the Sn-Ag-Cu/Cu Interfacial Reaction
	An, Lili; Ma, Haitao; Qu, Lin; Wang, Jie; Liu, Jiahui; Huang, Mingliang
	2013
会议名称	14th International Conference on Electronic Packaging Technology (ICEPT)
会议日期	2013-08-11
会议地点	Chinese Inst Elect, Dalian, PEOPLES R CHINA
关键词	lead-free solder laser-soldering IMC interfacial reaction
页码	264-267
会议录	14th International Conference on Electronic Packaging Technology (ICEPT)
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/4542932
专题	大连理工大学
作者单位	Dalian Univ Technol, Sch Mat Sci & Engn, Dalian, Peoples R China.
推荐引用方式 GB/T 7714	An, Lili,Ma, Haitao,Qu, Lin,et al. The Effect of Laser-soldering Parameters on the Sn-Ag-Cu/Cu Interfacial Reaction[C]. 见:14th International Conference on Electronic Packaging Technology (ICEPT). Chinese Inst Elect, Dalian, PEOPLES R CHINA. 2013-08-11.

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