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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 发表日期：2014    内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Study on the Verification of IR and RTD Methods Applied in the Thermal Measurement of High Power Chips 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), 2014-08-12 作者:  Zhang, Yan[1];  He, Chu-yun[2];  Zhang, Yong[3];  Fan, Jing-yu[4];  Fu, Yifeng[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/30 thermal measurement  IR  RTD   Reliability of carbon nanotube bumps for chip on glass application 会议论文 5th Electronics System-Integration Technology Conference, ESTC 2014, 2014-09-16 作者:  Fan, Xiaogang[1];  Li, Xiaolei[2];  Mu, Wei[3];  Jiang, Di[4];  Huang, Shirong[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30 Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), 2014-08-12 作者:  Sitek, Janusz[1];  Koscielski, Marek[2];  Zhang, Yan[3];  Fan, Jing-Yu[4];  Ma, Shiwei[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30 Electrically conductive adhesives  nano additives  mechanical properties  reliability of interconnects  printed electronics   Enhanced Heat Spreader Based on Few-Layer Graphene Intercalated With Silane-Functionalization Molecules 会议论文 2014 20TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC 2014), 2014-09-24 作者:  Han, Haoxue[1];  Kosevich, Yuriy A.[2];  Zhang, Yong[3];  Liu, Johan[4];  Fu, Yifeng[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/30