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	Study on the Verification of IR and RTD Methods Applied in the Thermal Measurement of High Power Chips
	Zhang, Yan[1]; He, Chu-yun[2]; Zhang, Yong[3]; Fan, Jing-yu[4]; Fu, Yifeng[5]; Liu, Johan[6]
	2014
会议名称	15th International Conference on Electronic Packaging Technology (ICEPT)
会议日期	2014-08-12
关键词	thermal measurement IR RTD
页码	1507-1511
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2272291
专题	上海大学
作者单位	1.[1]Shanghai Univ, Minist Educ, SMIT Ctr Sch Mechatron Engn & Automat, Shanghai, Peoples R China.,Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai, Peoples R China. 2.[2]Shanghai Univ, Minist Educ, SMIT Ctr Sch Mechatron Engn & Automat, Shanghai, Peoples R China.,Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai, Peoples R China. 3.[3]Shanghai Univ, Minist Educ, SMIT Ctr Sch Mechatron Engn & Automat, Shanghai, Peoples R China.,Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai, Peoples R China. 4.[4]Shanghai Univ, Shanghai Inst Appl Math & Mech, Shanghai, Peoples R China. 5.[5]SHT Smart High Tech AB, Gothenburg, Sweden. 6.[6]Chalmers, Dept Microtechnol & Nanosci, SMIT Ctr & Bionano Syst Lab, S-41296 Gothenburg, Sweden.
推荐引用方式 GB/T 7714	Zhang, Yan[1],He, Chu-yun[2],Zhang, Yong[3],et al. Study on the Verification of IR and RTD Methods Applied in the Thermal Measurement of High Power Chips[C]. 见:15th International Conference on Electronic Packaging Technology (ICEPT). 2014-08-12.

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