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	Reliability of carbon nanotube bumps for chip on glass application
	Fan, Xiaogang[1]; Li, Xiaolei[2]; Mu, Wei[3]; Jiang, Di[4]; Huang, Shirong[5]; Fu, Yifeng[6]; Zhang, Yan[7]; Liu, Johan[8]
	2014
会议名称	5th Electronics System-Integration Technology Conference, ESTC 2014
会议日期	2014-09-16
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2271220
专题	上海大学
作者单位	[1]SMIT Center, School of Automation and Mechanical Engineering, Shanghai University, Yanchang Road 149, Shanghai, China [2]SMIT Center, School of Automation and Mechanical Engineering, Shanghai University, Yanchang Road 149, Shanghai, China [3]SMIT Center, School of Automation and Mechanical Engineering, Shanghai University, Yanchang Road 149, Shanghai, China |BioNano Systems Laboratory, Department of Microtechnology and Nanoscience , Chalmers University of Technology, Goteborg, Sweden [4]BioNano Systems Laboratory, Department of Microtechnology and Nanoscience , Chalmers University of Technology, Goteborg, Sweden [5]SMIT Center, School of Automation and Mechanical Engineering, Shanghai University, Yanchang Road 149, Shanghai, China [6]SHT Smart High Tech AB, Aschebergsgatan 46, G?teborg, Sweden[7]SMIT Center, School of Automation and Mechanical Engineering, Shanghai University, Yanchang Road 149, Shanghai, China [8]SMIT Center, School of Automation and Mechanical Engineering, Shanghai University, Yanchang Road 149, Shanghai, China |BioNano Systems Laboratory, Department of Microtechnology and Nanoscience , Chalmers University of Technology, Goteborg, Sweden
推荐引用方式 GB/T 7714	Fan, Xiaogang[1],Li, Xiaolei[2],Mu, Wei[3],et al. Reliability of carbon nanotube bumps for chip on glass application[C]. 见:5th Electronics System-Integration Technology Conference, ESTC 2014. 2014-09-16.

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