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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 专题：兰州理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Microstructure and mechanical properties of extruded and aged Mg-Y-Cu alloy 期刊论文 Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2022, 卷号: 32, 期号: 3, 页码: 731-740 作者:  Bi, Guang-Li;  Zhang, Niu-Ming;  Jiang, Jing;  Chen, Ti-Jun;  Jiang, Chun-Hong 收藏  |  浏览/下载：19/0  |  提交时间：2022/06/20 Binary alloys  Magnesium alloys  Materials testing apparatus  Metastable phases  Microhardness  Microstructure  Precipitation (chemical)  Scanning electron microscopy  Tensile strength  Tensile testing  Ternary alloys  Transmission electron microscopy  Yttrium alloys  Extruded alloys  Extruded mg-Y-cu alloy  Grain interiors  Long period stacking ordered phase  LPSO phase  Mg matrix  Microscope scanning  Microstructures and mechanical properties  Optical microscopes  Transmission electron   Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs 期刊论文 Vacuum, 2020, 卷号: 180 作者:  Qiu, Hongyu;  Hu, Xiaowu;  Li, Shuang;  Wan, Yongqiang;  Li, Qinglin 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Binary alloys  Copper alloys  Elastic moduli  Fracture  Fracture mechanics  Shear flow  Soldered joints  Surface analysis  Tin alloys  Area ratios  Fracture mechanisms  Fracture surface analysis  Fracture surfaces  Fractured surfaces  Isothermal aging  Lead-free solder joint  Solder joints   Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Atomic force microscopy  Coatings  Copper compounds  Electroplating  Gold  Growth rate  Lead-free solders  Metallic films  Scanning electron microscopy  Semiconductor doping  Silver alloys  Silver metallography  Soldering  Substrates  Surface roughness  Ternary alloys  Thermal aging  Tin alloys  Tin compounds  Tin metallography  X ray photoelectron spectroscopy  Benzotriazole(BTA)  Electroplated Cu films  Heterocyclic compound  Interfacial microstructure evolution  Isothermal aging  Kovar substrates  Low concentrations  Soldering process   Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film 期刊论文 VACUUM, 2019, 卷号: 167, 页码: 428-437 作者:  Hu, Xiaowu;  Bao, Nifa;  Li, Qinglin 收藏  |  浏览/下载：13/0  |  提交时间：2019/11/15 Shear strength  Electroplated Cu  Aging  Kovar alloy  Microstructure   Investigation of the interfacial reactions and growth behavior of interfacial intermetallic compound between Sn37Pb solder and Au/Ni/Kovar substrate 期刊论文 MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 7 作者:  Bao, Nifa;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：12/0  |  提交时间：2019/11/15 Sn37Pb/Kovar system  TEM  growth kinetics  interfacial reaction  intermetallic compounds   Effect of flux doped with Cu6Sn5 nanoparticles on the interfacial reaction of lead-free solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 12, 页码: 11552-11562 作者:  Wang, Haozhong;  Hu, Xiaowu;  Li, Qinglin;  Qu, Min 收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15 Binary alloys  Coarsening  Copper  Growth rate  Morphology  Nanoparticles  Rate constants  Soldered joints  Tin alloys  Aging time  Cu substrate  IMC layer  Inhibition effect  Isothermal aging  Lead-free solder joint  Nanoparticle (NPs)  Solder joints   Enhancing strength and thermal stability of TWIP steels with a heterogeneous structure 期刊论文 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2018, 卷号: 720, 页码: 231-237 作者:  Xiong, T.;  Zheng, S. J.;  Zhou, Y. T.;  Pang, J. C.;  Jin, Q. Q. 收藏  |  浏览/下载：38/0  |  提交时间：2019/11/15 TWIP steel  Heterogeneous structure  Twin  High strength  Thermal stability   Effect of Annealing Temperature on the Microstructure and Tensile Properties of a Bimodal Nano/Micro Grained 1020 Carbon Steel Prepared by Aluminothermic Reaction Casting 期刊论文 METALS AND MATERIALS INTERNATIONAL, 2016, 卷号: 22, 期号: 2, 页码: 236-242 作者:  La, Peiqing;  Guo, Xin;  Wang, Hongding;  Shi, Ting;  Zhen, Xiaojuan 收藏  |  浏览/下载：4/0  |  提交时间：2019/11/15 aluminothermic reaction casting  scanning electron microscopy (SEM)  metals  annealing  mechanical properties   Effect of annealing temperature on the microstructure and tensile properties of a bimodal nano/micro grained 1020 carbon steel prepared by aluminothermic reaction casting 期刊论文 Metals and Materials International, 2016, 卷号: 22, 期号: 2, 页码: 236-242 作者:  La, Peiqing;  Guo, Xin;  Wang, Hongding;  Shi, Ting;  Zhen, Xiaojuan 收藏  |  浏览/下载：14/0  |  提交时间：2022/02/18 Annealing  Ferrite  High resolution transmission electron microscopy  Mechanical properties  Metals  Microcrystals  Microstructure  Nanocrystals  Pearlite  Scanning electron microscopy  Steel castings