×
验证码:
换一张
忘记密码?
记住我
CORC
首页
科研机构
检索
知识图谱
申请加入
托管服务
登录
注册
在结果中检索
科研机构
清华大学 [5]
西安交通大学 [4]
西安光学精密机械研究... [4]
力学研究所 [3]
北京航空航天大学 [3]
化学研究所 [3]
更多...
内容类型
期刊论文 [56]
发表日期
2024 [1]
2023 [1]
2022 [1]
2021 [3]
2020 [1]
2019 [2]
更多...
学科主题
Engineerin... [1]
Physics, A... [1]
Physics, C... [1]
×
知识图谱
CORC
开始提交
已提交作品
待认领作品
已认领作品
未提交全文
收藏管理
QQ客服
官方微博
反馈留言
浏览/检索结果:
共56条,第1-10条
帮助
限定条件
内容类型:期刊论文
已选(
0
)
清除
条数/页:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
排序方式:
请选择
作者升序
作者降序
题名升序
题名降序
发表日期升序
发表日期降序
提交时间升序
提交时间降序
Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics
期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 卷号: 14, 期号: 1, 页码: 10-17
作者:
Zhang, Bowen
;
Lu, Xinyan
;
Ma, Haoxiang
;
Wang, Di
;
Mei, Yun-Hui
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2024/05/07
Silver
Sintering
Force
Substrates
Copper
Bonding
Thermal stability
Reliability packaging
silver paste
sintering driving force
Characterization of Grid Lines Formed by Laser-Induced Forward Transfer and Effect of Laser Fluence on the Silver Paste Transformation
期刊论文
PHOTONICS, 2023, 卷号: 10, 期号: 7, 页码: 717
作者:
Yu YC(于玉翠)
;
Zhang YM(张艳梅)
;
Tian CX(田崇鑫)
;
He XL(何秀丽)
;
Li SX(李少霞)
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2023/09/05
micro structure fabricating
LIFT
solar cell grid lines
morphological characteristics
printing mechanisms
Morphological Characteristics and Printing Mechanisms of Grid Lines by Laser-Induced Forward Transfer
期刊论文
METALS, 2022, 卷号: 12, 期号: 12, 页码: 14
作者:
Zhang YM(张艳梅)
;
Tian CX(田崇鑫)
;
Yu YC(于玉翠)
;
He XL(何秀丽)
;
Bian YH(边艳华)
收藏
  |  
浏览/下载:80/0
  |  
提交时间:2023/02/03
laser-induced forward transfer (LIFT)
grid lines
morphology
transfer mechanism
metallization
Effect of interfacial microstructure evolution on the peeling strength and fracture of AMB Cu-metalized AlN substrate
期刊论文
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2021, 页码: 13
作者:
Zhang, Yukun
;
Zhang, Jinsong
;
Chen, Jichun
收藏
  |  
浏览/下载:50/0
  |  
提交时间:2021/11/22
active metal brazing
aluminum nitride
fracture
microstructure
strength
An integrated and sustainable hydrometallurgical process for enrichment of precious metals and selective separation of copper, zinc, and lead from a roasted sand
期刊论文
WASTE MANAGEMENT, 2021, 卷号: 132, 页码: 133-141
作者:
Liu, Gongqi
;
Pan, De'an
;
Wu, Yufeng
;
Yuan, Haoran
;
Yu, Lu
收藏
  |  
浏览/下载:49/0
  |  
提交时间:2021/10/27
Roasted sand
Recycle valuable elements
Hydrometallurgical process
Water leaching
High-chloride leaching
Optoelectronic Performance of 2D WSe2 Field Effect Transistor
期刊论文
Faguang Xuebao/Chinese Journal of Luminescence, 2021, 卷号: 42, 期号: 2, 页码: 257-263
作者:
F.-L. Xia
;
K.-X. Shi
;
D.-X. Zhao
;
Y.-P. Wang
;
Y. Fan and J.-H. Li
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2022/06/13
Application of Ag-ZnO Hybrid Film in Polymer Solar Cell
期刊论文
Faguang Xuebao/Chinese Journal of Luminescence, 2020, 卷号: 41, 期号: 4, 页码: 392-398
作者:
Z.-C. Xue, Q. Li, Z.-Q. Yu, M.-F. Yu, X.-Y. Guo and H. Sun
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2021/07/06
Correlation of microstructure and constitutive behaviour of sintered silver particles via nanoindentation
期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2019, 卷号: 161, 页码: 9
作者:
Long X
;
Hu B
;
Feng YH(冯义辉)
;
Chang C
;
Li MY
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2020/03/11
Silver nanoparticles
Silver microparticles
Nanoindentation
Microstructure
Constitutive behaviour
Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 774, 页码: 487-494
作者:
Zhang, Hongqiang
;
Wang, Wengan
;
Bai, Hailin
;
Zou, Guisheng
;
Liu, Lei
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/12/30
Microstructure
High temperature storage
Reliability
Die attach
Nano-Ag paste
Characterizations of a Proposed 3300-V Press-Pack IGBT Module Using Nanosilver Paste for High-Voltage Applications
期刊论文
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 4, 页码: 2245-2253
作者:
Feng, Jingjing
;
Mei, Yunhui
;
Li, Xianbin
;
Lu, Guo-Quan
收藏
  |  
浏览/下载:63/0
  |  
提交时间:2018/12/03
Electricity
Electronic Packaging
Joining Process
Nanoporous Materials
Thermal Resistance
©版权所有 ©2017 CSpace - Powered by
CSpace