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	Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications
	Zhang, Hongqiang; Wang, Wengan; Bai, Hailin; Zou, Guisheng; Liu, Lei; Peng, Peng; Guo, Wei
刊名	JOURNAL OF ALLOYS AND COMPOUNDS
	2019
卷号	774页码:487-494
关键词	Microstructure High temperature storage Reliability Die attach Nano-Ag paste
ISSN号	0925-8388
DOI	10.1016/j.jallcom.2018.10.067
URL标识	查看原文
收录类别	SCIE ; EI
WOS记录号	WOS:000449743600055
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5922838
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Zhang, Hongqiang,Wang, Wengan,Bai, Hailin,et al. Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2019,774:487-494.
APA	Zhang, Hongqiang.,Wang, Wengan.,Bai, Hailin.,Zou, Guisheng.,Liu, Lei.,...&Guo, Wei.(2019).Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications.JOURNAL OF ALLOYS AND COMPOUNDS,774,487-494.
MLA	Zhang, Hongqiang,et al."Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications".JOURNAL OF ALLOYS AND COMPOUNDS 774(2019):487-494.

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