Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics

doi:10.1109/TCPMT.2023.3347250

CORC > 深海科学与工程研究所 > 中国科学院深海科学与工程研究所 > 深海工程技术部 > 深海资源开发研究室

	Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics
	Zhang, Bowen 4; Lu, Xinyan 3; Ma, Haoxiang 2; Wang, Di 1; Mei, Yun-Hui 4
刊名	IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
	2024
卷号	14 期号:1 页码:10-17
关键词	Silver Sintering Force Substrates Copper Bonding Thermal stability Reliability packaging silver paste sintering driving force
ISSN号	2156-3950
DOI	10.1109/TCPMT.2023.3347250
英文摘要	The spontaneous aggregation and weak stability of nanosilver particles largely overshadowed the application of nanosilver paste as die-attach materials in wide bandgap (WBG) devices. Taking advantage of the self-decomposition of silver-ammonia complexes to form silver particles, a novel particle-free silver paste was successfully developed to achieve higher sintering driving force as well as bonding quality. The proposed silver paste not only promotes the decomposition of silver complex but also reduces the oxygen requirement during the decomposition process, which significantly increases the shear strength from 23.8 to 59.4 MPa. The crystallization behavior and microstructure evolution confirm that the temperature required for the formation of silver particles in the proposed silver paste was reduced to 150 degree celsius. At the same time, the necking growth also occurred at the low temperature of 150 degree celsius, which is much lower than previous research and successfully confirms the higher sintering driving force of the proposed silver paste. More importantly, the proposed sintered silver paste exhibited high thermal stability, and the overall shear strength degradation was only 29.5% after 1000 cycles of thermal shock test (TST). The high sintering driving force combined with the high thermal reliability of the proposed silver-complex paste enables the development of high-performance WBG semiconductors with superior mechanical and electrical properties.
资助项目	National Natural Science Foundation of China
WOS关键词	SHEAR-STRENGTH ; TEMPERATURE ; CONDUCTIVITY ; NANO ; PB
WOS研究方向	Engineering ; Materials Science
语种	英语
出版者	IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
WOS记录号	WOS:001178135100003
资助机构	National Natural Science Foundation of China
内容类型	期刊论文
源URL	[http://ir.idsse.ac.cn/handle/183446/10950]
专题	深海工程技术部_深海资源开发研究室
通讯作者	Zhang, Bowen; Mei, Yun-Hui
作者单位	1.Tiangong Univ, Sch Elect & Informat Engn, Tianjin 300350, Peoples R China 2.Chinese Acad Sci, Inst Deep Sea Sci & Engn, Sanya 572000, Peoples R China 3.Tiangong Univ, Sch Mech Engn, Tianjin 300350, Peoples R China 4.Tiangong Univ, Sch Elect Engn, Tianjin 300387, Peoples R China
推荐引用方式 GB/T 7714	Zhang, Bowen,Lu, Xinyan,Ma, Haoxiang,et al. Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2024,14(1):10-17.
APA	Zhang, Bowen,Lu, Xinyan,Ma, Haoxiang,Wang, Di,&Mei, Yun-Hui.(2024).Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,14(1),10-17.
MLA	Zhang, Bowen,et al."Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 14.1(2024):10-17.