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Investigations on the pumping behaviors of copper filler in Through-Silicon-vias (TSV) 会议论文
IEEE 67th Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, 2017-05-30
作者:  Su, Fei;  Yao, Ruixia;  Li, Tenghui;  Pan, Xiaoxu
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/30
Positron annihilation and TEM characterization of Cu-enriched clusters in the ferritic steels containing copper 会议论文
作者:  Chen, Zhilin;  Liu, Xiangbing;  Wu, Yichu;  Wang, Rongshan;  Xue, Fei
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/05
Positron lifetime calculation for plastic deformed nanocrystalline copper 会议论文
作者:  Zhou, Kai;  Zhang, Ting
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/05
Influence of Copper Contamination on Equilibrium Compositions, Thermodynamic Properties, Transport Coefficients, and Combined Diffusion Coefficients of High-temperature SF6 Gas 会议论文
作者:  Zhong, Linlin;  Wang, Xiaohua;  Wu, Yi;  Rong, Mingzhe;  Zhang, Xin
收藏  |  浏览/下载:15/0  |  提交时间:2019/12/02
Atomic diffusion and interface reaction of Cu/Si (111) films prepared by ionized cluster beam deposition 会议论文
17th International Conference on Surface Modification of Materials by Ion Beams (SMMIB), Harbin, PEOPLES R CHINA, SEP 13-17, 2011
作者:  Cao, B;  Yang, TR;  Li, GP;  Cho, S;  Kim, H
收藏  |  浏览/下载:3/0  |  提交时间:2017/01/20
Study on the Interface Diffusion Bonding of the Copper Alloy/30CrMnSi Steel 会议论文
Chinese Materials Congress (CMC 2012), Taiyuan, PEOPLES R CHINA, 2012-07-13
作者:  Zou, Juntao;  Liu, Yanfeng;  Pei, Lu;  Wang, Xianhui;  Liang, Shuhua
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/20
Diffusion barrier performance of nano-structured and amorphous Ru-Ge diffusion barriers for copper metallization 会议论文
作者:  He, Guohua;  Yao, Ling;  Song, Zhongxiao;  Li, Yanhuai;  Xu, Kewei
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/10
Investigation of surface coating preparation of high-aluminum bronze alloy by induction remelting process 会议论文
作者:  Yang, Xiao-tian;  Wang, Zhi-Ping;  Lu, Yang;  Li, Xia
收藏  |  浏览/下载:0/0  |  提交时间:2019/11/15
Thermal stability of Cu/Si (111) films prepared by ionized cluster beam technique 会议论文
2011 International Conference on Advanced Engineering Materials and Technology, AEMT 2011, Sanya, China, July 29, 2011 - July 31, 2011
作者:  Cao, Bo;  Jia, Yanhui;  Li, Gongping;  Cho, Seong Jin;  Kim, Hee
收藏  |  浏览/下载:3/0  |  提交时间:2017/01/20
Study on the diffusion properties of heavy metal copper ion in silty clay 会议论文
2011 International Conference on Civil Engineering and Transportation, ICCET 2011, October 14, 2011 - October 16, 2011
作者:  Zhang, Zhen-Ying;  Wu, Da-Zhi;  Cai, Qi-Mao
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/31


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