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西安交通大学 [4]
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会议论文 [16]
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Investigations on the pumping behaviors of copper filler in Through-Silicon-vias (TSV)
会议论文
IEEE 67th Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, 2017-05-30
作者:
Su, Fei
;
Yao, Ruixia
;
Li, Tenghui
;
Pan, Xiaoxu
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/30
TSV
copper pumping
micro-mechanism
acoustic emission
diffusion creep
Positron annihilation and TEM characterization of Cu-enriched clusters in the ferritic steels containing copper
会议论文
作者:
Chen, Zhilin
;
Liu, Xiangbing
;
Wu, Yichu
;
Wang, Rongshan
;
Xue, Fei
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/05
Positron lifetime calculation for plastic deformed nanocrystalline copper
会议论文
作者:
Zhou, Kai
;
Zhang, Ting
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/12/05
Influence of Copper Contamination on Equilibrium Compositions, Thermodynamic Properties, Transport Coefficients, and Combined Diffusion Coefficients of High-temperature SF6 Gas
会议论文
作者:
Zhong, Linlin
;
Wang, Xiaohua
;
Wu, Yi
;
Rong, Mingzhe
;
Zhang, Xin
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2019/12/02
combined diffusion coefficients
equilibrium compositions
SF6-Cu
thermodynamic properties
transport coefficients
Atomic diffusion and interface reaction of Cu/Si (111) films prepared by ionized cluster beam deposition
会议论文
17th International Conference on Surface Modification of Materials by Ion Beams (SMMIB), Harbin, PEOPLES R CHINA, SEP 13-17, 2011
作者:
Cao, B
;
Yang, TR
;
Li, GP
;
Cho, S
;
Kim, H
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2017/01/20
Interdiffusion
Interface reaction
Copper silicides
RBS
XRD
Study on the Interface Diffusion Bonding of the Copper Alloy/30CrMnSi Steel
会议论文
Chinese Materials Congress (CMC 2012), Taiyuan, PEOPLES R CHINA, 2012-07-13
作者:
Zou, Juntao
;
Liu, Yanfeng
;
Pei, Lu
;
Wang, Xianhui
;
Liang, Shuhua
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/20
Copper alloy
30CrMnSi steel
Interface diffusion
Transition layer
Diffusion barrier performance of nano-structured and amorphous Ru-Ge diffusion barriers for copper metallization
会议论文
作者:
He, Guohua
;
Yao, Ling
;
Song, Zhongxiao
;
Li, Yanhuai
;
Xu, Kewei
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/10
Cu interconnection
Diffusion barrier layer
Self-formation
Ru-Ge film
Investigation of surface coating preparation of high-aluminum bronze alloy by induction remelting process
会议论文
作者:
Yang, Xiao-tian
;
Wang, Zhi-Ping
;
Lu, Yang
;
Li, Xia
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  |  
浏览/下载:0/0
  |  
提交时间:2019/11/15
high aluminum copper alloy(Cu-14 Al-X)
induction remelting
coating
Thermal stability of Cu/Si (111) films prepared by ionized cluster beam technique
会议论文
2011 International Conference on Advanced Engineering Materials and Technology, AEMT 2011, Sanya, China, July 29, 2011 - July 31, 2011
作者:
Cao, Bo
;
Jia, Yanhui
;
Li, Gongping
;
Cho, Seong Jin
;
Kim, Hee
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2017/01/20
Film preparation
Annealing
Backscattering
Copper
Diffraction
Diffusion
Ionization
Ions
Metallic films
Rutherford backscattering spectroscopy
Silicides
Silicon
Spectrometry
Thermodynamic stability
X ray diffraction
Annealing temperatures
Atomic diffusions
Cu films
Interface reaction
Interface reactions
Ionized cluster beam (ICB)
Ionized cluster beams
P-type Si
Rutherford backscattering spectrometry
Rutherford backscattering spectrometry (RBS)
Si atoms
Si substrates
Thermally stable
X-ray diffraction (XRD)
XRD
Study on the diffusion properties of heavy metal copper ion in silty clay
会议论文
2011 International Conference on Civil Engineering and Transportation, ICCET 2011, October 14, 2011 - October 16, 2011
作者:
Zhang, Zhen-Ying
;
Wu, Da-Zhi
;
Cai, Qi-Mao
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/31
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