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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 发表日期：2020     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 The oxidation effect on the cracking behavior of a Co-based alloy under thermal shocks 期刊论文 Corrosion Science, 2020, 卷号: 173 作者:  Wen, Junxia;  Cao, Rui;  Che, Hongyan;  Dong, Hao;  Zhang, Haiyan 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Cracks  Electronics packaging  Oxidation  Thermal expansion  Thermal shock  Co-based alloys  Coefficients of thermal expansions  Cracking behavior  Oxidation behaviors  Oxidation effects  Sample surface  Static conditions  Volume change   A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave Modules 会议论文 Hong Kong, China, August 12, 2019 - August 15, 2019 作者:  Tian, Jun;  Wang, Congsi;  Liu, Shaoyi;  Zhu, Cheng;  Zhou, Cheng 收藏  |  浏览/下载：18/0  |  提交时间：2021/07/06 Microwave circuits  Belts  Electronics packaging  Flexible electronics  Gold  Integrated circuit interconnects  Microwaves  Timing circuits   Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文 Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81 作者:  Liu, Yun;  Yu, Weiyuan;  Sun, Xuemin;  Wang, Fengfeng 收藏  |  浏览/下载：9/0  |  提交时间：2022/02/17 Binary alloys  Dissolution  Electronics packaging  Energy dispersive spectroscopy  Intermetallics  Lead-free solders  Morphology  Needles  Scanning electron microscopy  Shear flow  Soldered joints  Soldering  Tin  Tin alloys  Tin metallography  Ultrasonic effects  Ultrasonic waves  Uranium metallography  Vanadium metallography  Design/methodology/approach  Dispersion strengthening  Energy dispersive X ray spectroscopy  Fractured surfaces  Grain morphologies  Grooves  Ultrasonic cavitation  Ultrasonic vibration   Evolution of the mechanical properties of a cobalt-based alloy under thermal shocks 期刊论文 Materials and Design, 2020, 卷号: 188 作者:  Wen, Junxia;  Che, Hongyan;  Cao, Rui;  Dong, Hao;  Ye, Youxiong 收藏  |  浏览/下载：17/0  |  提交时间：2020/11/14 Carbides  Electronics packaging  Hot isostatic pressing  Mechanical properties  Microstructural evolution  Nanoindentation  Scanning electron microscopy  Sintering  Thermal fatigue  Thermal shock  Carbide particles  Cobalt base alloys  Cobalt based alloy  Energy dispersion spectrum  High stress concentration  Nanoindentation tests  Reduced modulus  Thermal fatigue cracks   Evolution of the mechanical properties of a cobalt-based alloy under thermal shocks 会议论文 作者:  Wen, Junxia;  Che, Hongyan;  Cao, Rui;  Dong, Hao;  Ye, Youxiong 收藏  |  浏览/下载：2/0  |  提交时间：2020/12/18 Carbides  Electronics packaging  Hot isostatic pressing  Mechanical properties  Microstructural evolution  Nanoindentation  Scanning electron microscopy  Sintering  Thermal fatigue  Thermal shockCarbide particles  Cobalt base alloys  Cobalt based alloy  Energy dispersion spectrum  High stress concentration  Nanoindentation tests  Reduced modulus  Thermal fatigue cracks   Extremely high thermal conductivity of carbon fiber/epoxy with synergistic effect of MXenes by freeze-drying 期刊论文 COMPOSITES COMMUNICATIONS, 2020, 卷号: 19, 页码: 134-141 作者:  Guo, Liangchao;  Zhang, Zhenyu;  Li, Maohua;  Kang, Ruiyang;  Chen, Yapeng 收藏  |  浏览/下载：48/0  |  提交时间：2020/12/16 BORON-NITRIDE NANOSHEETS  EPOXY COMPOSITES  CARBIDE MXENE  NANOCOMPOSITES  FILMS  INTERCALATION  NANOCRYSTALS  ENHANCEMENT  EXFOLIATION  PERFORMANCE   Kinetics of dissolution of copper in liquid tin with ultrasonic waves 期刊论文 Materials Research, 2020, 卷号: 23, 期号: 1 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wu, Baolei;  Yang, Guoqing 收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14 Activation energy  Copper  Electronics packaging  Liquids  Tin  Ultrasonic waves  Dissolution behavior  Dissolution rates  Electronic Packaging  IMC layer  Immersion method  Immersion time  Ultrasonic power  Welding method   Kinetics of dissolution of copper in liquid tin with ultrasonic waves 期刊论文 Materials Research, 2020, 卷号: 23, 期号: 1 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wu, Baolei;  Yang, Guoqing 收藏  |  浏览/下载：4/0  |  提交时间：2022/02/18 Activation energy  Copper  Electronics packaging  Liquids  Tin  Ultrasonic waves