A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave Modules

doi:10.1109/ICEPT47577.2019.245165

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	A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave Modules
	Tian, Jun 7; Wang, Congsi 7; Liu, Shaoyi 7; Zhu, Cheng 7; Zhou, Cheng 6; Liu, Jing 6; Wang, Zhihai 5; Yu, Kunpeng 5; Wang, Lu 5; Zheng, Yuanpeng 4
	2020-04-30
会议日期	August 12, 2019 - August 15, 2019
会议地点	Hong Kong, China
关键词	Microwave circuits Belts Electronics packaging Flexible electronics Gold Integrated circuit interconnects Microwaves Timing circuits
DOI	10.1109/ICEPT47577.2019.245165
页码	9080946
国家	China
英文摘要	Microwave circuits and devices are widely used in the fields of communication, detection and chip components, etc. With the increasing demand of high speed, high reliability, miniaturization and integration of microwave electronic devices, the change of interconnection configuration in microwave components will have a significant impact on signal transmission performance. In this paper, a parametric representation model of flexible interconnection point configuration of gold belt in microwave module is established. Based on the parametric representation model, a coupling model is established to correlate the interconnection point configuration with signal transmission performance. This will provide theoretical guidance for engineers in interconnection design and transmission performance control, and ensure the design and service quality of high-performance electronic equipment. 2019 IEEE.
产权排序	7
会议录	2019 20th International Conference on Electronic Packaging Technology(ICEPT)
会议录出版者	Institute of Electrical and Electronics Engineers Inc.
语种	英语
URL标识	查看原文
ISBN号	978-1-7281-5065-9;978-1-7281-5064-2(eISBN)
内容类型	会议论文
源URL	[http://ir.xao.ac.cn/handle/45760611-7/4172]
专题	射电天文研究室_天线技术实验室
作者单位	1.China Academy of Sciences, XinJiang Astronomical Observatory, Urumqi, China 2.University of Chester, Department of Mechanical Engineering, Chester, United Kingdom; 3.University of New South Wales, School of Civil and Environmental Engineering, Sydney, Australia; 4.CETC No.54 Research Institute, Shijiazhuang, China; 5.CETC No.38 Research Institute, Hefei, China; 6.Xi'An Institute of Space Radio Technology, Xi'an, China; 7.Ministry of Education, Xidian University, Key Laboratory of Electronic Equipment Structure Design, Xi'an, China;
推荐引用方式 GB/T 7714	Tian, Jun,Wang, Congsi,Liu, Shaoyi,et al. A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave Modules[C]. 见:. Hong Kong, China. August 12, 2019 - August 15, 2019.