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CORC

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Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
收藏  |  浏览/下载：130/0  |  提交时间：2021/02/02
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Microstructure and properties of functional magnesium titanate ceramic joint brazed by bismuth-borate glass 期刊论文
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2019, 卷号: 39, 期号: 15, 页码: 4901
作者:  Jiang, Chonglai;  Lin, Panpa;  Chen, Qianqian;  Wang, Ce;  Lin, Tiesong
收藏  |  浏览/下载：337/0  |  提交时间：2019/12/26
The microstructure and properties of bronze matrix composites with surface-modified graphite by titanium carbide adhesion 期刊论文
TRIBOLOGY INTERNATIONAL, 2019, 卷号: 140
作者:  Pan, Jiaming;  Yin, Jinwei;  Xia, Yongfeng;  Yao, Dongxu;  Liang, Hanqin
收藏  |  浏览/下载：332/0  |  提交时间：2019/12/26
Effects of Dissimilar Alumina Particulates on Microstructure and Properties of Cold-Sprayed Alumina/A380 Composite Coatings 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 12, 页码: 1449-1458
作者:  Qiu, Xiang;  Tariq, Naeem ul Haq;  Qi, Lu;  Tang, Jun-Rong;  Cui, Xin-Yu
收藏  |  浏览/下载：37/0  |  提交时间：2021/02/02
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
Effect of nano-CeO2 addition on the consolidation of W-5Ni-3Cu alloy by a two-step sintering process 期刊论文
RESULTS IN PHYSICS, 2019, 卷号: 15
作者:  Dong, Hongfeng;  Gong, Jun;  Li, Wensheng
收藏  |  浏览/下载：19/0  |  提交时间：2022/03/01
The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration 期刊论文
MATERIALS LETTERS, 2019, 卷号: 256
作者:  Qiu, Hongyu;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin
收藏  |  浏览/下载：14/0  |  提交时间：2019/11/15
Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 810, 页码: 7
作者:  Sun, Hong;  Guo, Lijiang;  Deng, Nan;  Li, Xiaoyu;  Li, Jiangtao
收藏  |  浏览/下载：90/0  |  提交时间：2019/11/12
Integration of BaTiO3/CoFe2O4 multiferroic heterostructure on GaN semiconductor 期刊论文
CRYSTENGCOMM, 2019, 卷号: 21, 期号: 43, 页码: 6545
作者:  Li, Guanjie;  Li, Xiaomin;  Zhu, Qiuxiang;  Zhao, Junliang;  Gao, Xiangdong
收藏  |  浏览/下载：58/0  |  提交时间：2019/12/26

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