Structure and properties of Sn-Cu lead-free solders in electronics packaging

doi:10.1080/14686996.2019.1591168

CORC > 金属研究所 > 中国科学院金属研究所

	Structure and properties of Sn-Cu lead-free solders in electronics packaging
	Zhao, Meng 1; Zhang, Liang 1; Liu, Zhi-Quan 2; Xiong, Ming-Yue 1; Sun, Lei 3
刊名	SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
	2019-12-31
卷号	20 期号:1 页码:421-444
关键词	Sn-Cu microstructures IMC mechanical properties
ISSN号	1468-6996
DOI	10.1080/14686996.2019.1591168
通讯作者	Zhang, Liang(zhangliang@jsnu.edu.cn)
英文摘要	With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu lead-free solder alloys. From the microstructure and interfacial structure, the evolution law of the internal structure of solder alloy/solder joint was analysed, and the model and theory describing the formation/growth mechanism of interfacial IMC were introduced. In addition, the effects of alloying, particle strengthening and process methods on the properties of Sn-Cu lead-free solders, including wettability, melting and mechanical properties, were described. Finally, we outline the issues that need to be resolved in the future research. [GRAPHICS] .
资助项目	National Key R&D Program of China[2017YFB0305700] ; Natural Science Foundation of China[51475220] ; Key project of State Key Laboratory of Advanced Welding and Joining[AWJ19Z04] ; Six talent peaks project in Jiangsu Province[XCL-022] ; Qing Lan Project ; China Postdoctoral Science Foundation[2016M591464] ; [2015DFA50470]
WOS研究方向	Materials Science
语种	英语
出版者	TAYLOR & FRANCIS LTD
WOS记录号	WOS:000467812600001
资助机构	National Key R&D Program of China ; Natural Science Foundation of China ; Key project of State Key Laboratory of Advanced Welding and Joining ; Six talent peaks project in Jiangsu Province ; Qing Lan Project ; China Postdoctoral Science Foundation
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/133625]
专题	金属研究所_中国科学院金属研究所
通讯作者	Zhang, Liang
作者单位	1.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou, Jiangsu, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang, Liaoning, Peoples R China 3.Nanjing Univ Aeronaut & Astronaut, Coll Mech & Elect Engn, Nanjing, Jiangsu, Peoples R China
推荐引用方式 GB/T 7714	Zhao, Meng,Zhang, Liang,Liu, Zhi-Quan,et al. Structure and properties of Sn-Cu lead-free solders in electronics packaging[J]. SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,2019,20(1):421-444.
APA	Zhao, Meng,Zhang, Liang,Liu, Zhi-Quan,Xiong, Ming-Yue,&Sun, Lei.(2019).Structure and properties of Sn-Cu lead-free solders in electronics packaging.SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,20(1),421-444.
MLA	Zhao, Meng,et al."Structure and properties of Sn-Cu lead-free solders in electronics packaging".SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS 20.1(2019):421-444.