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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 发表日期：2019     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Atomic force microscopy  Coatings  Copper compounds  Electroplating  Gold  Growth rate  Lead-free solders  Metallic films  Scanning electron microscopy  Semiconductor doping  Silver alloys  Silver metallography  Soldering  Substrates  Surface roughness  Ternary alloys  Thermal aging  Tin alloys  Tin compounds  Tin metallography  X ray photoelectron spectroscopy  Benzotriazole(BTA)  Electroplated Cu films  Heterocyclic compound  Interfacial microstructure evolution  Isothermal aging  Kovar substrates  Low concentrations  Soldering process   Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film 期刊论文 VACUUM, 2019, 卷号: 167, 页码: 428-437 作者:  Hu, Xiaowu;  Bao, Nifa;  Li, Qinglin 收藏  |  浏览/下载：13/0  |  提交时间：2019/11/15 Shear strength  Electroplated Cu  Aging  Kovar alloy  Microstructure   Investigation of the interfacial reactions and growth behavior of interfacial intermetallic compound between Sn37Pb solder and Au/Ni/Kovar substrate 期刊论文 MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 7 作者:  Bao, Nifa;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：12/0  |  提交时间：2019/11/15 Sn37Pb/Kovar system  TEM  growth kinetics  interfacial reaction  intermetallic compounds   Effect of flux doped with Cu6Sn5 nanoparticles on the interfacial reaction of lead-free solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 12, 页码: 11552-11562 作者:  Wang, Haozhong;  Hu, Xiaowu;  Li, Qinglin;  Qu, Min 收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15 Binary alloys  Coarsening  Copper  Growth rate  Morphology  Nanoparticles  Rate constants  Soldered joints  Tin alloys  Aging time  Cu substrate  IMC layer  Inhibition effect  Isothermal aging  Lead-free solder joint  Nanoparticle (NPs)  Solder joints   Effects of Isothermal Aging on Microstructure and Mechanical Property of Low-Carbon RAFM Steel 期刊论文 金属学报(英文版), 2019, 卷号: 第9期, 页码: 1151-1160 作者:  Jian-Guo Chen;  Chen-Xi Liu;  Chen Wei;  Yong-Chang Liu;  Hui-Jun Li 收藏  |  浏览/下载：1/0  |  提交时间：2019/11/21 Precipitation behavior of high-Nb containing modified HR3C heat-resistant steels during isothermal aging 期刊论文 2019, 卷号: 35, 页码: 1717-1726 作者:  Bai, Jiaming;  Yuan, Yong;  Zhang, Peng;  Yan, Jingbo;  You, Caiyin 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/20 HR3C  austenitic heat-resistant steel  microstructure stability  sigma phase  thermal aging  alloying elements  Cr content  yield strength