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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 发表日期：2017     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package 期刊论文 IEEE Transactions on Components Packaging and Manufacturing Technology, 2017 作者:  Liu FM(刘丰满);  Cao LQ(曹立强);  Hou FZ(侯峰泽) 收藏  |  浏览/下载：11/0  |  提交时间：2018/05/11 Warpage optimization of fiber-reinforced composite injection molding by combining back propagation neural network and genetic algorithm 期刊论文 International Journal of Advanced Manufacturing Technology, 2017, 卷号: 90, 期号: 1-4, 页码: 963-970 作者:  Li, Kun;  Yan, Shilin*;  Pan, Wenfeng;  Zhao, Gang 收藏  |  浏览/下载：9/0  |  提交时间：2019/12/04 Injection molding  Warpage optimization  Orthogonal experiment design  Back propagation neural network  Genetic algorithm   Pressure Analysis of Dynamic Injection Molding and Process Parameter Optimization for Reducing Warpage of Injection Molded Products 期刊论文 POLYMERS, 2017, 卷号: 9 作者:  Wang, Xinyu;  Li, Hongxia;  Gu, Junfeng;  Li, Zheng;  Ruan, Shilun 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02 dynamic injection molding  warpage optimization  pressure response analysis  kriging model  EGO method   Influence of Viscoelastic Underfill on Thermal Mechanical Reliability of a 3-D-TSV Stack by Simulation 期刊论文 IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2017 Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 Microbump  thermal mechanical reliability  through-silicon-via  underfill  viscoelasticity  SOLDER  WARPAGE  FATIGUE  PACKAGE   Research on warpage deformation mechanism & control method of fused deposition 期刊论文 2017, 卷号: 417, 页码: 729-737 作者:  Liu, Linlin;  Wan, Chuliang;  Li, Kaikai;  Wu, Jimei 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/20 Warpage deformation  Control method  Process parameters