Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package | |
Liu FM(刘丰满); Cao LQ(曹立强); Hou FZ(侯峰泽) | |
刊名 | IEEE Transactions on Components Packaging and Manufacturing Technology |
2017-10-05 | |
文献子类 | 期刊论文 |
内容类型 | 期刊论文 |
源URL | [http://159.226.55.106/handle/172511/17962] |
专题 | 微电子研究所_系统封装与集成研发中心 |
推荐引用方式 GB/T 7714 | Liu FM,Cao LQ,Hou FZ. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package[J]. IEEE Transactions on Components Packaging and Manufacturing Technology,2017. |
APA | 刘丰满,曹立强,&侯峰泽.(2017).Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package.IEEE Transactions on Components Packaging and Manufacturing Technology. |
MLA | 刘丰满,et al."Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package".IEEE Transactions on Components Packaging and Manufacturing Technology (2017). |
个性服务 |
查看访问统计 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论