Influence of Viscoelastic Underfill on Thermal Mechanical Reliability of   a 3-D-TSV Stack by Simulation

doi:10.1109/TDMR.2017.2682273

CORC > 北京大学 > 信息科学技术学院

	Influence of Viscoelastic Underfill on Thermal Mechanical Reliability of a 3-D-TSV Stack by Simulation
	Zeng, Qinghua ; Guan, Yong ; Su, Fei ; Chen, Jing ; Jin, Yufeng
刊名	IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
	2017
关键词	Microbump thermal mechanical reliability through-silicon-via underfill viscoelasticity SOLDER WARPAGE FATIGUE PACKAGE
DOI	10.1109/TDMR.2017.2682273
英文摘要	In this paper, we focus on how viscoelastic underfill influences the thermal mechanical reliability of a 3-D through-silicon-via (3-D-TSV) stack. The Williams-Landel-Ferry equation and relaxation of the modulus in the Prony series are used to describe the viscoelastic properties of underfill in detail. The 3-D-TSV stack consists of a four-layer die stack, a silicon interposer, a printed circuit board, TSVs, microbumps, and solder balls. Simulation results show that, with underfill applied, chip warpage is worse and the residual stress of the microbumps is increased. Therefore, a design suggestion is proposed where underfill with a lower coefficient of thermal expansion is preferred in 3-D-TSV stacks for applications under-going heavy thermal cycles. In terms of simulation accuracy, the simulation is compared with the simplified treatment where underfill is considered completely elastic. We conclude that defining the viscoelasticity properties is more relevant for underfill than elasticity.; National High Technology Research and Development Program of China (863 Program) [2015AA043601]; SCI(E); ARTICLE; 2; 340-348; 17
语种	英语
内容类型	期刊论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/462358]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Zeng, Qinghua,Guan, Yong,Su, Fei,et al. Influence of Viscoelastic Underfill on Thermal Mechanical Reliability of a 3-D-TSV Stack by Simulation[J]. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY,2017.
APA	Zeng, Qinghua,Guan, Yong,Su, Fei,Chen, Jing,&Jin, Yufeng.(2017).Influence of Viscoelastic Underfill on Thermal Mechanical Reliability of a 3-D-TSV Stack by Simulation.IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY.
MLA	Zeng, Qinghua,et al."Influence of Viscoelastic Underfill on Thermal Mechanical Reliability of a 3-D-TSV Stack by Simulation".IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY (2017).