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High Temperature Reliability and Failure of W-based Microhotplates 会议论文
2015 IEEE SENSORS, 2015-11-01
作者:  Zhou, Junwei;  Yu, Jun;  Li, Zhongzhou;  Liu, Kaiqiang;  Tang, Zhenan
收藏  |  浏览/下载:5/0  |  提交时间:2019/12/09
Modeling and Simulation for the Thermo-mechanical Interfacial Reliability of Through-silicon-via for 3D IC Integration 会议论文
作者:  Jiang, Hao;  Cao, Gang;  Luo, Zhang;  Xu, Chunlin;  Li, Cao
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/05


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