QQ客服 官方微博 反馈留言

浏览/检索结果: 共5条，第1-5条 帮助 限定条件 专题：北京航空航天大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Micrometer-Scale Kirkendall Effect in the Formation of High-Temperature Resistant Cr2O3/Al2O3 Solid Solution Hollow Fibers 期刊论文 CHEMISTRY OF MATERIALS, 2018, 卷号: 30, 页码: 5978-5986 作者:  Cao, Shuwei;  Zhang, Yue;  Zhang, Dahai;  Fan, Jinpeng;  Zhang, Jingyi 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/30 Alumina  Aluminum oxide  Ceramic materials  Chromium compounds  Coremaking  Costs  Diffusion  Fabrication  Fibers  Heat resistance  Liquids  Pore size  Temperature control  Ceramic hollow fibers  Formation mechanism  High temperature resistance  Hollow structure  Kirkendall effects  Low cost methods  Nano-scaled metals  Pollutant emission  Solid solutions   A Titration Mechanism Based Congestion Model 会议论文 2018 IEEE 18TH INTERNATIONAL CONFERENCE ON SOFTWARE QUALITY, RELIABILITY AND SECURITY COMPANION (QRS-C), 2018-01-01 作者:  Wang, Chunlin;  Huang, Ning;  Sun, Lina;  Wen, Guoyi 收藏  |  浏览/下载：9/0  |  提交时间：2019/12/30 network congestion diffusion  resource competing  titration mechanism  failure propagation  network reliability   Mechanism and kinetics of halogenated compound removal by metallic iron: Transport in solution, diffusion and reduction within corrosion films 期刊论文 CHEMOSPHERE, 2017, 卷号: 178, 页码: 119-128 作者:  Tang, Shun;  Wang, Xiao-mao;  Liu, Shi-ting;  Yang, Hong-wei;  Xie, Yuefeng F. 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/30 Zero-valent iron (Fe-0)  Corrosion films  Removal mechanism  Kinetic model  Mass diffusion   Bottom-up sandwich-porous copper films: Facile construction, growth mechanism, and super-elastic property 期刊论文 MATERIALS & DESIGN, 2017, 卷号: 135, 页码: 151-158 作者:  Peng, Yuncheng;  Zhu, Wei;  Shen, Shengfei;  Feng, Lishuang;  Deng, Yuan 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30 Nanoporous copper  Growth mechanism  Surface diffusion  Sticking probability  Magnetron sputtering   Investigations on the pumping behaviors of copper filler in Through-Silicon-vias (TSV) 会议论文 IEEE 67th Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, 2017-05-30 作者:  Su, Fei;  Yao, Ruixia;  Li, Tenghui;  Pan, Xiaoxu 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/30 TSV  copper pumping  micro-mechanism  acoustic emission  diffusion creep