| Bottom-up sandwich-porous copper films: Facile construction, growth mechanism, and super-elastic property | |
| Peng, Yuncheng; Zhu, Wei; Shen, Shengfei; Feng, Lishuang; Deng, Yuan | |
| 刊名 | MATERIALS & DESIGN
 |
| 2017 | |
| 卷号 | 135页码:151-158 |
| 关键词 | Nanoporous copper Growth mechanism Surface diffusion Sticking probability Magnetron sputtering |
| ISSN号 | 0264-1275 |
| DOI | 10.1016/j.matdes.2017.09.022 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE |
| WOS记录号 | WOS:000413236300017 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5937750 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Peng, Yuncheng,Zhu, Wei,Shen, Shengfei,et al. Bottom-up sandwich-porous copper films: Facile construction, growth mechanism, and super-elastic property[J]. MATERIALS & DESIGN,2017,135:151-158. |
| APA | Peng, Yuncheng,Zhu, Wei,Shen, Shengfei,Feng, Lishuang,&Deng, Yuan.(2017).Bottom-up sandwich-porous copper films: Facile construction, growth mechanism, and super-elastic property.MATERIALS & DESIGN,135,151-158. |
| MLA | Peng, Yuncheng,et al."Bottom-up sandwich-porous copper films: Facile construction, growth mechanism, and super-elastic property".MATERIALS & DESIGN 135(2017):151-158. |
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