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科研机构
兰州理工大学 [4]
内容类型
期刊论文 [4]
发表日期
2022 [1]
2020 [1]
2011 [2]
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A simultaneous enhancement of both strength and ductility by a novel differential-thermal ECAP process in Mg-Sn-Zn-Zr alloy
期刊论文
Journal of Alloys and Compounds, 2022, 卷号: 889
作者:
Zhou, Tianshui
;
Zhang, Quanfa
;
Li, Qianqian
;
Wang, Lidong
;
Li, Qinglin
收藏
  |  
浏览/下载:30/0
  |  
提交时间:2022/02/17
Ductility
Formability
Grain boundaries
Grain refinement
Grain size and shape
Magnesium alloys
Textures
Tin alloys
Zinc alloys
Zircaloy
Channel angular pressing
Differential thermals
Differential-thermal equal-channel angular pressing
ECAP processing
Equal channel angular
Mechanical
Prismatic
slip
Property
Strength and ductilities
Zr alloys
Fabricate of High-Strength and High-Conductivity Cu-Cr-Si Alloys through ECAP-Bc and Aging Heat Treatment
期刊论文
MATERIALS, 2020, 卷号: 13, 期号: 7
作者:
Guo, Tingbiao
;
Wang, Junjie
;
Wu, Yibo
;
Tai, Xiaoyang
;
Jia, Zhi
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2020/06/02
Cu-1Cr-0
2Si alloy
equal channel angular pressing (ECAP)
electron back-scattered diffraction (EBSD)
texture
mechanical properties
electrical conductivity
Effect of microstructure and temperature on oxidation behavior of pure copper
期刊论文
Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment, 2011, 卷号: 32, 期号: 12, 页码: 147-150
作者:
Cao, Jun
;
Ding, Yu-Tian
;
Lu, Zhen-Hua
;
Hu, Yong
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2020/11/14
Atoms
Copper
Crystal atomic structure
Equal channel angular pressing
Grain boundaries
Grain size and shape
Pressing (forming)
X ray diffraction
Atomic packing
Close-packed planes
Copper oxidation
Copper surface
Crystal planes
Different structure
Diffusion rate
ECAP
Grain size
Internal energies
Low energies
Oxidation behaviors
Oxidation film
Oxidation rate
Oxidation rates
Oxygen atom
Polycrystalline copper
Pure copper
Temperature increase
Weight gain
Effect of microstructure and temperature on oxidation behavior of pure copper
期刊论文
Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment, 2011, 卷号: 32, 期号: 12, 页码: 147-150
作者:
Cao, Jun
;
Ding, Yu-Tian
;
Lu, Zhen-Hua
;
Hu, Yong
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2022/02/17
Atoms
Copper
Crystal atomic structure
Equal channel angular pressing
Grain boundaries
Grain size and shape
Pressing (forming)
X ray diffraction
Atomic packing
Close-packed planes
Copper oxidation
Copper surface
Crystal planes
Different structure
Diffusion rate
ECAP
Grain size
Internal energies
Low energies
Oxidation behaviors
Oxidation film
Oxidation rate
Oxidation rates
Oxygen atom
Polycrystalline copper
Pure copper
Temperature increase
Weight gain
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