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Rate-dependent nanoindentation creep behavior of a Fe-based amorphous coating 期刊论文
Journal of Non-Crystalline Solids, 2022, 卷号: 590
作者:  Zhai, Haimin;  Zhang, Yongang;  He, Dongqing;  Zhang, Xinjian;  Cheng, Bo
收藏  |  浏览/下载：201/0  |  提交时间：2022/06/20
Relationship Between Creep Deformation and Materials Structure of Metal Thin Films 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2022, 卷号: 51, 期号: 5, 页码: 1674-1680
作者:  Wu Jinping;  Li Chunchen;  Zhao Bin;  Qiu Longshi;  Xin Chao
收藏  |  浏览/下载：24/0  |  提交时间：2022/07/19
Singularities of Contact Stress and Electric Field During Indentation of Piezoelectric Ceramics by Cylindrical, Flat Indenter 期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2022, 卷号: 51, 期号: 4, 页码: 1218-1225
作者:  Chen, Wenke;  Jin, Wuyin
收藏  |  浏览/下载：177/0  |  提交时间：2022/06/20
Singularities of Contact Stress and Electric Field During Indentation of Piezoelectric Ceramics by Cylindrical, Flat Indenter 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2022, 卷号: 51, 期号: 4, 页码: 1218-1225
作者:  Chen Wenke;  Jin Wuyin
收藏  |  浏览/下载：174/0  |  提交时间：2022/07/19
Room temperature nanoindentation creep behavior of detonation sprayed Fe-based amorphous coating 期刊论文
INTERMETALLICS, 2022, 卷号: 141
作者:  Zhai, Haimin;  Ma, Xu;  Cheng, Bo;  He, Dongqing;  Zhang, Xinjian
收藏  |  浏览/下载：26/0  |  提交时间：2022/03/01
Finite element analysis of indentation contact of double piezoelectric spheres 期刊论文
MATERIALS TODAY COMMUNICATIONS, 2021, 卷号: 29
作者:  Chen, Wenke;  Jin, Wuyin;  Cao, Hui
收藏  |  浏览/下载：173/0  |  提交时间：2021/12/17
Effect of Friction Stir Welding on Bulk Metallic Glasses 期刊论文
JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION, 2021, 卷号: 36, 期号: 5, 页码: 624-628
作者:  Zhang Xiangyun;  Zhang Mi;  Chen Wenbin;  Yuan Zizhou
收藏  |  浏览/下载：18/0  |  提交时间：2022/03/01
The microstructures and mechanical properties of martensite Ti and TiN phases in a Ti6Al4V laser-assisted nitriding layer 期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 178
作者:  Zhang, Penglin;  Cheng, Qianqian;  Yi, Gewen;  Wang, Wenzhen;  Liu, Yanyan
收藏  |  浏览/下载：3/0  |  提交时间：2021/10/14
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid-liquid electromigration 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：18/0  |  提交时间：2021/10/14
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：13/0  |  提交时间：2022/02/17

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