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科研机构

西安理工大学 [17]

北京大学 [14]

北京航空航天大学 [10]

武汉大学 [5]

华南理工大学 [4]

力学研究所 [2]

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会议论文 [11]

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浏览/检索结果: 共61条，第1-10条

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	Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74 作者: Song M; Wei ZQ; Wang BY; Chen L; Chen L 收藏 \| 浏览/下载：55/0 \| 提交时间：2019/11/27 Through-silicon via Cu protrusion Annealing temperature Electron backscatter diffraction Finite element analysis
	THERMAL MANAGEMENT OF THE THROUGH SILICON VIAS IN 3-D INTEGRATED CIRCUITS 期刊论文 THERMAL SCIENCE, 2019, 卷号: 23, 期号: 4, 页码: 2157-2162 作者: Wang, Kang-Jia; Hua, Chu-Xia; Sun, Hong-Chang 收藏 \| 浏览/下载：7/0 \| 提交时间：2019/12/11 thermal through silicon via 3-D integrated circuit nanoscale flow
	Investigation on impact of substrate on low-pass filter based on coaxial TSV 期刊论文 2019, 卷号: 16 作者: Wang, Fengjuan; Li, He; Yu, Ningmei 收藏 \| 浏览/下载：4/0 \| 提交时间：2019/12/20 through-silicon-via (TSV) low-pass filter (LPF) substrate impact
	Fabrication and measurement of 3D LPF based on coaxial TSV 期刊论文 2019, 卷号: 55, 页码: 102-+ 作者: Wang, Fengjuan; Li, He; Yu, Ningmei 收藏 \| 浏览/下载：6/0 \| 提交时间：2019/12/20 finite element analysis three-dimensional integrated circuits low-pass filters passive filters CMOS integrated circuits standard CMOS process 3D LPF architecture coaxial TSV passive low-pass filters 3D LPF measurement 3D LPF fabrication through-silicon via finite element method
	LC Low-pass filter based on through-silicon via 会议论文 2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01 作者: Wang, Fengjuan; Huang, Jia; Yu, Ningmei 收藏 \| 浏览/下载：3/0 \| 提交时间：2019/12/20 low-pass filter through-silicon via (TSV) three-dimensional integrated circuits (3-D IC)
	A highly efficient heat-dissipation system using RDL and TTSV array in 3D IC 会议论文 2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01 作者: Wang, Fengjuan; Li, Yue; Yu, Ningmei 收藏 \| 浏览/下载：10/0 \| 提交时间：2019/12/20 three-dimensional integrated circuits (3-D IC) thermal through-silicon via (TTSV) redistribution layer (RDL) heat-dissipation
	An Effective Method of Reducing TSV Thermal Stress by STI 会议论文 2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01 作者: Wang, Fengjuan; Qu, Xiaoqing; Yu, Ningmei 收藏 \| 浏览/下载：4/0 \| 提交时间：2019/12/20 Keywords Three-dimensional integrated circuits (3-D IC) through-silicon via (TSV) shallow trench isolation (STI) thermal stress keep-out zone (KOZ)
	A high-pass filter based on through-silicon via (TSV) 期刊论文 2019, 卷号: 16, 页码: 1-3 作者: Wang, Fengjuan; Huang, Jia; Yu, Ningmei 收藏 \| 浏览/下载：8/0 \| 提交时间：2019/12/20 through-silicon via (TSV) high-pass filter three-dimensional integrated circuit (3D IC)
	Mechanically strengthened graphene-Cu composite with reduced thermal expansion towards interconnect applications 期刊论文 MICROSYSTEMS & NANOENGINEERING, 2019, 卷号: 5, 页码: 20 作者: An, Zhonglie; Li, Jinhua; Kikuchi, Akio; Wang, Zhuqing; Jiang, Yonggang 收藏 \| 浏览/下载：101/0 \| 提交时间：2019/12/30 Copper compounds Electronics packaging Graphene Integration Mechanical properties MEMS Natural frequencies Thermal expansion Three dimensional integrated circuits Coefficients of thermal expansions Composite microstructures Interconnect applications Laser Doppler vibrometers Mechanical resonant frequencies Micro electro mechanical system Thermal expansion mismatch Through-Silicon-Via (TSV) Integrated circuit interconnects

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