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	THERMAL MANAGEMENT OF THE THROUGH SILICON VIAS IN 3-D INTEGRATED CIRCUITS
	Wang, Kang-Jia; Hua, Chu-Xia; Sun, Hong-Chang
刊名	THERMAL SCIENCE
	2019
卷号	23期号:4页码:2157-2162
关键词	thermal through silicon via 3-D integrated circuit nanoscale flow
DOI	10.2298/TSCI1904157W
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4554893
专题	山东大学
作者单位	1.Henan Polytech Univ, Sch Phys & Elect Informat Engn, Jiaozuo, Henan, Peoples R China. 2.Huizhou Econ & Polytech Coll,
推荐引用方式 GB/T 7714	Wang, Kang-Jia,Hua, Chu-Xia,Sun, Hong-Chang. THERMAL MANAGEMENT OF THE THROUGH SILICON VIAS IN 3-D INTEGRATED CIRCUITS[J]. THERMAL SCIENCE,2019,23(4):2157-2162.
APA	Wang, Kang-Jia,Hua, Chu-Xia,&Sun, Hong-Chang.(2019).THERMAL MANAGEMENT OF THE THROUGH SILICON VIAS IN 3-D INTEGRATED CIRCUITS.THERMAL SCIENCE,23(4),2157-2162.
MLA	Wang, Kang-Jia,et al."THERMAL MANAGEMENT OF THE THROUGH SILICON VIAS IN 3-D INTEGRATED CIRCUITS".THERMAL SCIENCE 23.4(2019):2157-2162.

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