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西安理工大学 [7]

北京航空航天大学 [5]

北京大学 [3]

清华大学 [1]

近代物理研究所 [1]

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	Evaluation Method of Heavy-Ion-Induced Single-Event Upset in 3D-Stacked SRAMs 期刊论文 ELECTRONICS, 2020, 卷号: 9, 期号: 8, 页码: 14 作者: Zhao, Peixiong; Liu, Tianqi; Cai, Chang; He, Ze; Li, Dongqing 收藏 \| 浏览/下载：17/0 \| 提交时间：2021/12/15 Monte-Carlo simulation single-event upset test standard three-dimensional integrated circuits ultrahigh-energy heavy ion
	Fabrication and measurement of 3D LPF based on coaxial TSV 期刊论文 2019, 卷号: 55, 页码: 102-+ 作者: Wang, Fengjuan; Li, He; Yu, Ningmei 收藏 \| 浏览/下载：6/0 \| 提交时间：2019/12/20 finite element analysis three-dimensional integrated circuits low-pass filters passive filters CMOS integrated circuits standard CMOS process 3D LPF architecture coaxial TSV passive low-pass filters 3D LPF measurement 3D LPF fabrication through-silicon via finite element method
	LC Low-pass filter based on through-silicon via 会议论文 2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01 作者: Wang, Fengjuan; Huang, Jia; Yu, Ningmei 收藏 \| 浏览/下载：3/0 \| 提交时间：2019/12/20 low-pass filter through-silicon via (TSV) three-dimensional integrated circuits (3-D IC)
	A highly efficient heat-dissipation system using RDL and TTSV array in 3D IC 会议论文 2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01 作者: Wang, Fengjuan; Li, Yue; Yu, Ningmei 收藏 \| 浏览/下载：10/0 \| 提交时间：2019/12/20 three-dimensional integrated circuits (3-D IC) thermal through-silicon via (TTSV) redistribution layer (RDL) heat-dissipation
	An Effective Method of Reducing TSV Thermal Stress by STI 会议论文 2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01 作者: Wang, Fengjuan; Qu, Xiaoqing; Yu, Ningmei 收藏 \| 浏览/下载：4/0 \| 提交时间：2019/12/20 Keywords Three-dimensional integrated circuits (3-D IC) through-silicon via (TSV) shallow trench isolation (STI) thermal stress keep-out zone (KOZ)
	Development of an infrared polarized microscope for evaluation of high gradient stress with a small distribution area on a silicon chip 期刊论文 REVIEW OF SCIENTIFIC INSTRUMENTS, 2019, 卷号: 90, 页码: 063108 作者: Su, Fei; Li, Tenghui 收藏 \| 浏览/下载：30/0 \| 提交时间：2019/12/30 Birefringence Electronics packaging Light polarization Optical devices Silicon Thermal cycling Three dimensional integrated circuits Distribution area High gradient stress Phase difference Phase-shifting technique Polarized microscope Quarter wave-plate Stress birefringence Through silicon vias Vibrations (mechanical)
	Mechanically strengthened graphene-Cu composite with reduced thermal expansion towards interconnect applications 期刊论文 MICROSYSTEMS & NANOENGINEERING, 2019, 卷号: 5, 页码: 20 作者: An, Zhonglie; Li, Jinhua; Kikuchi, Akio; Wang, Zhuqing; Jiang, Yonggang 收藏 \| 浏览/下载：101/0 \| 提交时间：2019/12/30 Copper compounds Electronics packaging Graphene Integration Mechanical properties MEMS Natural frequencies Thermal expansion Three dimensional integrated circuits Coefficients of thermal expansions Composite microstructures Interconnect applications Laser Doppler vibrometers Mechanical resonant frequencies Micro electro mechanical system Thermal expansion mismatch Through-Silicon-Via (TSV) Integrated circuit interconnects
	A low-pass filter made up of the cylindrical through-silicon-via 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者: Wang, Fengjuan; Huang, Jia; Yu, Ningmei 收藏 \| 浏览/下载：3/0 \| 提交时间：2019/12/20 Three-dimensional integrated circuits (3D IC) through-silicon-via (TSV) low-pass filter
	Development of Auto Infrared Photoelastic Microscope for Stress Measurement of Silicon 会议论文 Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018 作者: Li, T.; Yao, R.; Yu, C.; Su, F. 收藏 \| 浏览/下载：4/0 \| 提交时间：2019/12/30 Cracks Elasticity Electronics packaging Light polarization Microscopes Optical devices Silicon carbide Silicon wafers Stresses Wafer bonding Wide band gap semiconductors Electronic Packaging Heating platform Phase difference Quarter wave-plate Si-based materials Silicon-based materials Stress birefringence Temperature cycling tests Three dimensional integrated circuits
	Fine-pitch through-silicon via integration with self-aligned back-side benzocyclobutene passivation layer 期刊论文 MICRO & NANO LETTERS, 2016 Guan, Yong; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng 收藏 \| 浏览/下载：3/0 \| 提交时间：2017/12/03 three-dimensional integrated circuits passivation organic compounds sputter etching chemical mechanical polishing radiography optical microscopy scanning electron microscopy vector network analyser four probe electrical measurement scanning electron microscopy optical microscopy X-ray radiographic testing repeatability chemical mechanical polishing plasma etching back side benzocyclobutene passivation layer self aligned benzocyclobutene passivation layer fine pitch thr

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