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CORC

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Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 卷号: 14, 期号: 1, 页码: 10-17
作者:  Zhang, Bowen;  Lu, Xinyan;  Ma, Haoxiang;  Wang, Di;  Mei, Yun-Hui
收藏  |  浏览/下载：0/0  |  提交时间：2024/05/07
Low-Pressure-Assisted Large-Area (>800 mm²) Sintered-Silver Bonding for High-Power Electronic Packaging 期刊论文
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018, 卷号: Vol.8 No.2, 页码: 202-209
作者:  Tan, Y.-S.a;  Li, X.b,c;  Chen, X.a;  Lu, G.-Q.d;  Mei, Y.-H.b,c
收藏  |  浏览/下载：7/0  |  提交时间：2019/11/21
The influence of sintering process on thermal properties of nano-silver paste 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Lu, Xiuzhen[1];  Zhang, Qianran[2];  Zehri, Abdelhafid[3];  Ke, Wei[4];  Huang, Shirong[5]
收藏  |  浏览/下载：15/0  |  提交时间：2019/04/22
Preparation and Thermal Analysis of the nano-silver/Graphene composite material for packaging module 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Liu, Dongjing[1];  Fan, Yasong[2];  Yan, Haidong[3];  Lin, Haiying[4];  Zhu, Haidong[5]
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/24
Thermal Stability of Silver Paste Sintering on Coated Copper and Aluminum Substrates 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2018, 卷号: 47, 页码: 811-819
作者:  Pei, Chun;  Chen, Chuantong;  Suganuma, Katsuaki;  Fu, Guicui
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/30
Electronic Materials, Devices, and Signals in Electrochemical Sensors 期刊论文
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2017
Cui, Yue
收藏  |  浏览/下载：37/0  |  提交时间：2017/12/03
Preparation of nickel-silver core-shell nanoparticles by liquid-phase reduction for use in conductive paste 期刊论文
JOURNAL OF EXPERIMENTAL NANOSCIENCE, 2015, 卷号: 10, 期号: 17, 页码: 1347-1356
作者:  Jing, Jun Jie[1];  Xie, Jimin[2];  Chen, Gao Yuan[3];  Li, Wen Hua[4];  Zhang, Ming Mei[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/24
Impact of interface microstructure on adhesion force between silver paste and silicon solar cells' emitter 期刊论文
CLEAN TECHNOLOGIES AND ENVIRONMENTAL POLICY, 2014, 卷号: 16, 期号: [db:dc_citation_issue], 页码: 655-659
作者:  Yang, Hong;  Chen, Chuanke;  Wang, He;  Cao, Dingyue;  Lei, Xiandao
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/03
Influence Factors on the Size of Spherical Silver Powder Used for Solar Cell Top Electrode Paste 会议论文
Chinese Materials Congress (CMC 2012), Taiyuan, PEOPLES R CHINA, 2013-01-01
作者:  Zhang, Si;  Zhu, Yuelin;  Song, Jia
收藏  |  浏览/下载：4/0  |  提交时间：2020/01/06
Electrodes with extremely high hydrogen overvoltages as substrate electrodes for stripping analysis based on bismuth-coated electrodes 期刊论文
analytica chimica acta, 2012, 卷号: 738, 页码: 41-44
Tian Y; Hu LZ; Han S; Yuan YL; Wang JG; Xu GB
收藏  |  浏览/下载：17/0  |  提交时间：2013/04/23

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