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INVESTIGATION ON INTERFACIAL THERMAL RESISTANCES OF Al/Cu STRUCTURE BY USING HYBRID MODELING WITH MULTISCALE CHARACTERISTICS 期刊论文
INTERNATIONAL JOURNAL FOR MULTISCALE COMPUTATIONAL ENGINEERING, 2014, 卷号: 12, 期号: 3, 页码: 211-221
作者:  Yang, Ping[1];  Zhao, Yanfang[2];  Zhang, Liqiang[3];  Tang, Yunqingn[4];  Yang, Haiying[5]
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/24
Thermal Characterization of Si3N4 Thin Films Using Transient Thermoreflectance Technique 期刊论文
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2009, 卷号: 56, 页码: 3238-3243
作者:  Bai, Suyuan;  Tang, Zhenan;  Huang, Zhengxing;  Yu, Jun
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/24


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