| Thermal Characterization of Si3N4 Thin Films Using Transient Thermoreflectance Technique | |
| Bai, Suyuan; Tang, Zhenan; Huang, Zhengxing; Yu, Jun | |
| 刊名 | IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
 |
| 2009 | |
| 卷号 | 56页码:3238-3243 |
| 关键词 | Genetic algorithms (GAs) interfacial thermal resistance (ITR) thermal conductivity (TC) transient thermoreflectance technique |
| ISSN号 | 0278-0046 |
| URL标识 | 查看原文 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5309568 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, Sch Elect & Informat Engn, Dept Elect Engn, Dalian 116024, Peoples R China.,Liaoning Normal Univ, Sch Phys & Elect Technol, Dalian 116029, Peoples R China. 2.Dalian Univ Technol, Inst Microelect, Dalian 116024, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Bai, Suyuan,Tang, Zhenan,Huang, Zhengxing,et al. Thermal Characterization of Si3N4 Thin Films Using Transient Thermoreflectance Technique[J]. IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS,2009,56:3238-3243. |
| APA | Bai, Suyuan,Tang, Zhenan,Huang, Zhengxing,&Yu, Jun.(2009).Thermal Characterization of Si3N4 Thin Films Using Transient Thermoreflectance Technique.IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS,56,3238-3243. |
| MLA | Bai, Suyuan,et al."Thermal Characterization of Si3N4 Thin Films Using Transient Thermoreflectance Technique".IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS 56(2009):3238-3243. |
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