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浏览/检索结果: 共3条，第1-3条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Influence of Copper Pumping on Integrity and Stress of Through-Silicon Vias 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2016 Su, Fei; Pan, Xiaoxu; Huang, Pengfei; Guan, Yong; Chen, Jing; Ma, Shenglin 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/04 Copper pumping  infrared photoelasticity  in situ experimental technique  integrity  scanning electron microscopy (SEM)  stress  through-silicon vias (TSVs)  CU PROTRUSION  FABRICATION   Development and Application of a Micro-infrared Photoelasticity System for Stress Evaluation of Through-silicon Vias (TSV) 会议论文 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015-01-01 作者:  Su, Fei;  Lan, Tianbao;  Pan, Xiaoxu;  Zhang, Zheng 收藏  |  浏览/下载：2/0  |  提交时间：2020/01/06 Through-Silicon Vias (TSV)  stress  infrared photoelasticity  finite element analysis  hybrid method   Stress evaluation of Through-Silicon Vias using micro-infrared photoelasticity and finite element analysis 期刊论文 OPTICS AND LASERS IN ENGINEERING, 2015, 卷号: 74, 页码: 87-93 作者:  Su, Fei;  Lan, Tianbao;  Pan, Xiaoxu 收藏  |  浏览/下载：3/0  |  提交时间：2020/01/06 Through-silicon vias (TSV)  Stress  Infrared photoelasticity  Finite element analysis  Hybrid method