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上海大学 [17]

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	AIBA as Free Radical Initiator for Abrasive-Free Polishing of Hard Disk Substrate 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2015, 卷号: 44, 页码: 1245-1252 作者: Lei, Hong[1]; Ren, Xiaoyan[2] 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/04/26 Abrasive-free polishing hard disk substrate material removal rate initiator AIBA
	Preparation of porous alumina-g-polystyrene sulfonic acid abrasive and its chemical mechanical polishing behavior on hard disk substrate 期刊论文 MICROELECTRONIC ENGINEERING, 2014, 卷号: 116, 页码: 11-16 作者: Huang, Liqin[1]; Wang, Zhijun[2]; Lei, Hong[3]; Chen, Ruling[4] 收藏 \| 浏览/下载：12/0 \| 提交时间：2019/04/30 Chemical mechanical polishing (CMP) Porous alumina-g-polystyrene sulfonic acid abrasive Hard disk substrate Planarization
	Influence of Zn (II) ion on abrasive-free polishing of hard disk substrate 期刊论文 THIN SOLID FILMS, 2014, 卷号: 562, 页码: 377-382 作者: Lei, Hong[1]; Zhao, Rong[2]; Chen, Ruling[3] 收藏 \| 浏览/下载：4/0 \| 提交时间：2019/04/30 Abrasive-free polishing Hard disk substrate Zinc (II) Ion Material removal rate Tribochemistry
	Abrasive-free polishing of hard disk substrate with H2O2-K2S2O8-NaHSO3 slurry 会议论文 MATERIAL DESIGN, PROCESSING AND APPLICATIONS, PARTS 1-4, 2013-03-30 作者: Zhang, Weitao[1]; Lei, Hong[2] 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/04/30 Abrasive-free polishing (AFP) hard disk substrate material removal rate (MRR) initiator
	Effect of K2S2O8 on material removal rate in abrasive-free polishing of hard disk substrate 会议论文 MATERIAL DESIGN, PROCESSING AND APPLICATIONS, PARTS 1-4, 2013-03-30 作者: Zhao, Rong[1]; Lei, Hong[2] 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/04/30 abrasive-free polishing hard disk substrate material removal rate K2S2O8 initiator
	Abrasive-free polishing of hard disk substrate with H2O2-C4H10O2-Na2S2O5 slurry 期刊论文 FRICTION, 2013, 卷号: 1, 页码: 359-366 作者: Zhang, Weitao[1]; Lei, Hong[2] 收藏 \| 浏览/下载：3/0 \| 提交时间：2019/04/30 abrasive-free polishing material removal rate initiator hard disk substrate
	Effect of pH on hard disk substrate polishing in glycine-hydrogen peroxide system abrasive-free slurry 会议论文 MICRO-NANO TECHNOLOGY XIV, PTS 1-4, 2012-11-04 作者: Chen Sisi[1]; Lei Hong[2]; Chen Ruling[3] 收藏 \| 浏览/下载：3/0 \| 提交时间：2019/04/30 abrasive free polishing (AFP) glycine hydrogen peroxide hard disk substrate
	Preparation of copper-incorporated mesoporous alumina abrasive and its CMP behavior on hard disk substrate 期刊论文 POWDER TECHNOLOGY, 2012, 卷号: 219, 页码: 99-104 作者: Lei, Hong[1]; Jiang, Lei[2]; Chen, Ruling[3] 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/04/30 Chemical mechanical polishing (CMP) Copper-incorporated mesoporous alumina abrasive Hard disk substrate Polishing active element
	Preparation of porous alumina abrasives and their chemical mechanical polishing behavior 期刊论文 THIN SOLID FILMS, 2012, 卷号: 520, 页码: 2868-2872 作者: Lei, Hong[1]; Wu, Xin[2]; Chen, Ruling[3] 收藏 \| 浏览/下载：3/0 \| 提交时间：2019/04/30 Chemical mechanical polishing (CMP) Porous alumina abrasive Hard disk substrate Planarization
	Preparation of porous Fe2O3/SiO2 nanocomposite abrasives and their chemical mechanical polishing behaviors on hard disk substrates 期刊论文 THIN SOLID FILMS, 2012, 卷号: 520, 页码: 6174-6178 作者: Li, Hu[1]; Lei, Hong[2]; Chen, Ruling[3] 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/04/30 Chemical mechanical polishing Hard disk substrate Porous Fe2O3/SiO2 nanocomposite Material removal rate Polishing active element

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