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兰州理工大学 [5]
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上海光学精密机械研究... [1]
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会议论文 [2]
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Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond diamond plates
期刊论文
MATERIALS AND MANUFACTURING PROCESSES, 2017, 卷号: 32, 页码: 121-126
作者:
Gao, Shang
;
Kang, Ren-Ke
;
Dong, Zhi-Gang
;
Zhang, Bi
;
Wang, Zi-Guang
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
Damage
diamond
efficiency
grinding
mechanism
removal
sapphire
subsurface
surface
topography
wafer
Effects of polishing parameters on evolution of different wafer patterns during Cu CMP
期刊论文
IEEE Transactions on Semiconductor Manufacturing, 2015, 卷号: 28, 期号: 1, 页码: 106-116
作者:
Wu, Lixiao
;
Yan, Changfeng
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2020/11/14
Copper
Elastic moduli
Erosion
Linear systems
Polishing
Topography
Chemical mechanical polishing(CMP)
Contact pressures
High selectivity
Polishing parameters
Polishing processs
Preston coefficients
Selectivity ratio
Wafer patterns
An analytical model of contact pressure caused by 2-D wafer topography in chemical-mechanical polishing process
会议论文
Shanghai, China, March 18, 2012 - March 19, 2012
作者:
Wu, Lixiao
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  |  
浏览/下载:5/0
  |  
提交时间:2020/11/15
Chemical analysis
Geometry
Polishing
Semiconductor device manufacture
Silicon wafers
Topography
Chemical mechanical polishing(CMP)
Chemical-mechanical polishing process
Contact pressures
Elastic half space
Linear time-invariant system
Magnitude spectrum
Pattern features
Wafer topography
Research on topography control of two-spindle and three-workstation wafer grinder
期刊论文
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C-JOURNAL OF MECHANICAL ENGINEERING SCIENCE, 2011, 卷号: 225, 页码: 2232-2241
作者:
Zhu, X. L.
;
Kang, R. K.
;
Feng, G.
;
Lv, H. M.
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/18
grinder
chuck topography
silicon wafer
chuck dressing
modelling
旋转圆盘空蚀试验中的硅材料破坏过程研究
期刊论文
2010, 2010
蒋娜娜
;
徐臻
;
陈大融
;
李浩群
;
JIANG Na-na
;
XU Zhen
;
CHEN Da-rong
;
LI Hao-qun
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  |  
浏览/下载:3/0
3-D modeling of wafer topography's effect on chemical mechanical polishing process
会议论文
Vienna, Austria, October 4, 2009 - October 9, 2009
作者:
Wu, Lixiao
;
Yan, Changfeng
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2020/11/15
Chemical mechanical polishing
Polishing
Semiconductor materials
Silicon wafers
Chemical-mechanical polishing process
Complicated topographies
Contact pressures
Linear combinations
Magnitude spectrum
Polishing parameters
Solid-solid contacts
Wafer topography
In situ surface topography measurement method of granite base in scanning wafer stage with laser interferometer
期刊论文
optik, 2008, 卷号: 119, 期号: 1, 页码: 1, 6
He Le
;
王向朝
;
Shi Weijie
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  |  
浏览/下载:941/145
  |  
提交时间:2009/09/18
laser interferometer
topography measurement
least squares method
scanning wafer stage
lithographic tool
Modeling of wafer topography's chemical-mechanical polishing effect on process
期刊论文
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2007, 卷号: 20, 期号: 4, 页码: 439-450
作者:
Wu, Lixiao
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/11/15
chemical-mechanical polishing (CMP)
contact mechanics
finite-element method (FEM)
Fourier transform
wafer surface topography
Modeling of wafer topography's effect on chemical-mechanical polishing process
期刊论文
IEEE Transactions on Semiconductor Manufacturing, 2007, 卷号: 20, 期号: 4, 页码: 439-450
作者:
Wu, Lixiao
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2020/11/14
Polishing
Topography
Chemical mechanical polishing(CMP)
Chemical-mechanical polishing process
Complex topographies
High frequency components
Linear time-invariant system
Low-frequency components
Magnitude spectrum
Wafer topography
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