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兰州理工大学 [5]

大连理工大学 [2]

清华大学 [1]

上海光学精密机械研究... [1]

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	Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond diamond plates 期刊论文 MATERIALS AND MANUFACTURING PROCESSES, 2017, 卷号: 32, 页码: 121-126 作者: Gao, Shang; Kang, Ren-Ke; Dong, Zhi-Gang; Zhang, Bi; Wang, Zi-Guang 收藏 \| 浏览/下载：3/0 \| 提交时间：2019/12/02 Damage diamond efficiency grinding mechanism removal sapphire subsurface surface topography wafer
	Effects of polishing parameters on evolution of different wafer patterns during Cu CMP 期刊论文 IEEE Transactions on Semiconductor Manufacturing, 2015, 卷号: 28, 期号: 1, 页码: 106-116 作者: Wu, Lixiao; Yan, Changfeng 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/14 Copper Elastic moduli Erosion Linear systems Polishing Topography Chemical mechanical polishing(CMP) Contact pressures High selectivity Polishing parameters Polishing processs Preston coefficients Selectivity ratio Wafer patterns
	An analytical model of contact pressure caused by 2-D wafer topography in chemical-mechanical polishing process 会议论文 Shanghai, China, March 18, 2012 - March 19, 2012 作者: Wu, Lixiao 收藏 \| 浏览/下载：5/0 \| 提交时间：2020/11/15 Chemical analysis Geometry Polishing Semiconductor device manufacture Silicon wafers Topography Chemical mechanical polishing(CMP) Chemical-mechanical polishing process Contact pressures Elastic half space Linear time-invariant system Magnitude spectrum Pattern features Wafer topography
	Research on topography control of two-spindle and three-workstation wafer grinder 期刊论文 PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C-JOURNAL OF MECHANICAL ENGINEERING SCIENCE, 2011, 卷号: 225, 页码: 2232-2241 作者: Zhu, X. L.; Kang, R. K.; Feng, G.; Lv, H. M. 收藏 \| 浏览/下载：3/0 \| 提交时间：2019/12/18 grinder chuck topography silicon wafer chuck dressing modelling
	旋转圆盘空蚀试验中的硅材料破坏过程研究期刊论文 2010, 2010 蒋娜娜; 徐臻; 陈大融; 李浩群; JIANG Na-na; XU Zhen; CHEN Da-rong; LI Hao-qun 收藏 \| 浏览/下载：3/0
	3-D modeling of wafer topography's effect on chemical mechanical polishing process 会议论文 Vienna, Austria, October 4, 2009 - October 9, 2009 作者: Wu, Lixiao; Yan, Changfeng 收藏 \| 浏览/下载：3/0 \| 提交时间：2020/11/15 Chemical mechanical polishing Polishing Semiconductor materials Silicon wafers Chemical-mechanical polishing process Complicated topographies Contact pressures Linear combinations Magnitude spectrum Polishing parameters Solid-solid contacts Wafer topography
	In situ surface topography measurement method of granite base in scanning wafer stage with laser interferometer 期刊论文 optik, 2008, 卷号: 119, 期号: 1, 页码: 1, 6 He Le; 王向朝; Shi Weijie 收藏 \| 浏览/下载：941/145 \| 提交时间：2009/09/18 laser interferometer topography measurement least squares method scanning wafer stage lithographic tool
	Modeling of wafer topography's chemical-mechanical polishing effect on process 期刊论文 IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2007, 卷号: 20, 期号: 4, 页码: 439-450 作者: Wu, Lixiao 收藏 \| 浏览/下载：9/0 \| 提交时间：2019/11/15 chemical-mechanical polishing (CMP) contact mechanics finite-element method (FEM) Fourier transform wafer surface topography
	Modeling of wafer topography's effect on chemical-mechanical polishing process 期刊论文 IEEE Transactions on Semiconductor Manufacturing, 2007, 卷号: 20, 期号: 4, 页码: 439-450 作者: Wu, Lixiao 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/14 Polishing Topography Chemical mechanical polishing(CMP) Chemical-mechanical polishing process Complex topographies High frequency components Linear time-invariant system Low-frequency components Magnitude spectrum Wafer topography

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