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浏览/检索结果: 共15条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033 作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD 收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05 Stress-relaxation  Void Formation  Electromigration  Reliability  Sn  Interconnections  Thermomigration  Metallization  Mechanisms  Diffusion   In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient 期刊论文 MATERIALS CHEMISTRY AND PHYSICS, 2018, 卷号: 216, 页码: 130-135 作者:  Zhong, Y.;  Zhao, N.;  Dong, W.;  Wang, Y. P.;  Ma, H. T. 收藏  |  浏览/下载：8/0  |  提交时间：2019/12/02 Synchrotron radiation  Thermomigration  Solder interconnect  Cross-interaction  Intermetallic layer   Formation mechanism of a cathodic serrated interface and voids under high current density 期刊论文 MATERIALS LETTERS, 2018, 卷号: 211, 页码: 191-194 作者:  Zhang, Z. H.[1,2];  Cao, H. J.[3];  Chen, H. T.[4] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/22 Diffusion  Interfaces  Electromigration  Thermomigration  Solder  Intermetallic compound   Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Under Thermomigration 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 页码: 1931-1936 作者:  Zhao, N.;  Deng, J. F.;  Zhong, Y.;  Huang, M. L.;  Ma, H. T. 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02 Soldering  thermomigration  interfacial reaction  intermetallic compound  Sn-9Zn  dissolution   Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 695, 页码: 1436-1443 作者:  Zhong, Y.;  Zhao, N.;  Ma, H. T.;  Dong, W.;  Huang, M. L. 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02 Thermomigration  Synchrotron radiation  Temperature gradient  Interfacial reaction  Zn addition  Dissolution   Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applications by imposing temperature gradient 会议论文 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017-01-01 作者:  Zhong, Y.;  Zhao, N.;  Ma, H. T.;  Dong, W.;  Huang, M. L. 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09 High-temperature electronic packaging  in situ observation  transient liquid phase bonding  thermomigration  intermetallic compound   Thermomigration-induced asymmetrical precipitation of Ag3Sn plates in micro-scale Cu/Sn-3.5Ag/Cu interconnects 期刊论文 MATERIALS & DESIGN, 2016, 卷号: 89, 页码: 116-120 作者:  Huang, M. L.;  Yang, F.;  Zhao, N. 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/09 Thermomigration  Synchrotron radiation  Crystal growth  Precipitation  Intermetallic compound   On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient 期刊论文 MATERIALS LETTERS, 2016, 卷号: 172, 页码: 211-215 作者:  Kunwar, Anil;  Ma, Haoran;  Ma, Haitao;  Sun, Junhao;  Zhao, Ning 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09 Thermomigration  Metals and alloys  Diffusion  Synchrotron radiation  Finite element method  Intermetallic alloys and compounds   Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient 期刊论文 INTERMETALLICS, 2016, 卷号: 79, 页码: 28-34 作者:  Zhao, N.;  Zhong, Y.;  Huang, M. L.;  Ma, H. T.;  Dong, W. 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09 Intermetallics  3D packaging  Synchrotron radiation  Thermomigration  Micro interconnect  Interfacial reaction   In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 卷号: 682, 页码: 1-6 作者:  Zhao, N.;  Zhong, Y.;  Huang, M. L.;  Dong, W.;  Ma, H. T. 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09 Synchrotron radiation  Soldering  Thermomigration  Interfacial reaction  Grain orientation  Intermetallic compound