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	Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient
	Zhao, N.; Zhong, Y.; Huang, M. L.; Ma, H. T.; Dong, W.
刊名	INTERMETALLICS
	2016
卷号	79页码:28-34
关键词	Intermetallics 3D packaging Synchrotron radiation Thermomigration Micro interconnect Interfacial reaction
ISSN号	0966-9795
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4370970
专题	大连理工大学
作者单位	Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China.
推荐引用方式 GB/T 7714	Zhao, N.,Zhong, Y.,Huang, M. L.,et al. Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient[J]. INTERMETALLICS,2016,79:28-34.
APA	Zhao, N.,Zhong, Y.,Huang, M. L.,Ma, H. T.,&Dong, W..(2016).Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient.INTERMETALLICS,79,28-34.
MLA	Zhao, N.,et al."Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient".INTERMETALLICS 79(2016):28-34.

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