CORC

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CORC

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Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang
收藏  |  浏览/下载：18/0  |  提交时间：2022/08/09
Wetting of substoichiometric YSZ2-x by molten Sn-based active alloys at 800–900 °C 期刊论文
Ceramics International, 2022, 卷号: 48, 期号: 20, 页码: 30621-30629
作者:  Sui, Ran;  Tan, Kaihui;  Lin, Qiaoli;  Xie, Kaibin
收藏  |  浏览/下载：21/0  |  提交时间：2022/08/09
Wetting of YSZ by molten Sn-8Zr, Sn-4Zr-4Ti, and Sn-8Ti alloys at 800-900 degrees C 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 1, 页码: 373-380
作者:  Lin, Qiaoli;  Tan, Kaihui;  Wang, Le;  Sui, Ran
收藏  |  浏览/下载：20/0  |  提交时间：2022/03/01
Effect of Electric Field on the Microstructure and Properties of Brazed Joints of Float Glass and Kovar 4J29 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2021, 卷号: 50, 期号: 11, 页码: 4003-4009
作者:  Yu Weiyuan;  Yang Guoqing;  Sun Xuemin;  Wang Fengfeng;  Zhang Tao
收藏  |  浏览/下载：9/0  |  提交时间：2022/03/01
Comparative study on wetting of smooth and rough silica surface by molten Sn-3.5Ag-2Ti alloys 期刊论文
CERAMICS INTERNATIONAL, 2021, 卷号: 47, 期号: 20, 页码: 29205-29212
作者:  Lin, Qiaoli;  Wang, Chaopeng;  Xie, Kaibin;  Wang, Le;  Sui, Ran
收藏  |  浏览/下载：26/0  |  提交时间：2021/10/14
Comparative study on wetting of smooth and rough silica surface by molten Sn–3.5Ag–2Ti alloys 期刊论文
Ceramics International, 2021, 卷号: 47, 期号: 20, 页码: 29205-29212
作者:  Lin, Qiaoli;  Wang, Chaopeng;  Xie, Kaibin;  Wang, Le;  Sui, Ran
收藏  |  浏览/下载：21/0  |  提交时间：2022/02/17
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong
收藏  |  浏览/下载：2/0  |  提交时间：2022/02/17
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong
收藏  |  浏览/下载：8/0  |  提交时间：2020/11/14
The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文
MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6
作者:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang;  He, Xin
收藏  |  浏览/下载：70/0  |  提交时间：2021/02/02
Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：16/0  |  提交时间：2020/11/14

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