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CORC

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High power 250W CW conductively cooled diode laser arrays with low-smile 会议论文
San Francisco, CA, United states, 2020-02-03
作者:  Zhang, Hongyou;  Zhu, Pengfei;  Fu, Tuanwei;  Li, Meiqin;  Lv, Ning
收藏  |  浏览/下载：11/0  |  提交时间：2020/05/18
The Pouring Process Optimization for the Conductive Slip-Rin 期刊论文
Materials Science Forum, 2019, 卷号: Vol.943, 页码: 5
作者:  Zhang, K.L.a;  Hong, B.a;  Zhang, L.P.a;  Ji, Y.b;  Gao, Z.D.b
收藏  |  浏览/下载：7/0  |  提交时间：2019/11/21
A Modified Vacuum Packaging Technology for the Conductive Slip-Ring Encapsulating with Epoxy Molding Compounds 期刊论文
Materials Science Forum, 2019, 卷号: Vol.943, 页码: 5
作者:  Hong, B.a;  Gao, Z.D.b;  Gao, J.Y.b;  Ji, Y.b;  Lv, S.Y.b
收藏  |  浏览/下载：10/0  |  提交时间：2019/11/21
The Soaking Process Optimization for the Conductive Slip-Ring 期刊论文
Materials Science Forum, 2019, 卷号: Vol.943, 页码: 5
作者:  Zhang, L.P.a;  Hong, B.a;  Zhang, K.L.a;  Gao, J.Y.b;  Ji, Y.b
收藏  |  浏览/下载：6/0  |  提交时间：2019/11/21
Application of micro/nano technology for thermal management of high power LED packaging - A review 期刊论文
APPLIED THERMAL ENGINEERING, 2018, 卷号: 145, 页码: 637-651
作者:  Hamidnia, M.;  Luo, Y.;  Wang, X. D.
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02
Research on the packaging design based on flash and paper vision 3D technology 期刊论文
Journal of Advanced Oxidation Technologies, 2018, 卷号: 21, 期号: 2
作者:  Zhang, S.*
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/24
An introduction of resistive arrays and packaging technology 会议论文
作者:  Sun Q;  Liu DF;  Gong HM
收藏  |  浏览/下载：24/0  |  提交时间：2018/11/20
Fabrication, Characterization, and Simulation of a Low-Cost TSV Integration Without Front-Side CMP Process 期刊论文
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2016
Guan, Yong; Zhu, Yunhui; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Bian, Yuan; Zhong, Xiao; Chen, Jing; Ma, Shenglin; Zhu, Yunhui; Jin, Yufeng
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03

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