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	A Modified Vacuum Packaging Technology for the Conductive Slip-Ring Encapsulating with Epoxy Molding Compounds
	Hong, B.a; Gao, Z.D.b; Gao, J.Y.b; Ji, Y.b; Lv, S.Y.b
刊名	Materials Science Forum
	2019
卷号	Vol.943页码:5
关键词	Conductive Slip-Ring Epoxy Molding Compounds Packaging Technology Pouring Model Soaking Model
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2900032
专题	天津大学
作者单位	1.aInternal Combustion Engine Research Institute, Tianjin University, Tianjin, 300072, China 2.bTianbo Science & Technology Co. Ltd, Tianjin, 300072, China
推荐引用方式 GB/T 7714	Hong, B.a,Gao, Z.D.b,Gao, J.Y.b,et al. A Modified Vacuum Packaging Technology for the Conductive Slip-Ring Encapsulating with Epoxy Molding Compounds[J]. Materials Science Forum,2019,Vol.943:5.
APA	Hong, B.a,Gao, Z.D.b,Gao, J.Y.b,Ji, Y.b,&Lv, S.Y.b.(2019).A Modified Vacuum Packaging Technology for the Conductive Slip-Ring Encapsulating with Epoxy Molding Compounds.Materials Science Forum,Vol.943,5.
MLA	Hong, B.a,et al."A Modified Vacuum Packaging Technology for the Conductive Slip-Ring Encapsulating with Epoxy Molding Compounds".Materials Science Forum Vol.943(2019):5.

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