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Evaluation Method of Heavy-Ion-Induced Single-Event Upset in 3D-Stacked SRAMs 期刊论文
ELECTRONICS, 2020, 卷号: 9, 期号: 8, 页码: 14
作者:  Zhao, Peixiong;  Liu, Tianqi;  Cai, Chang;  He, Ze;  Li, Dongqing
收藏  |  浏览/下载:17/0  |  提交时间:2021/12/15
Software-Based Self-Testing Using Bounded Model Checking for Out-of-Order Superscalar Processors 期刊论文
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2020, 卷号: 39, 期号: 3, 页码: 714-727
作者:  Zhang, Ying;  Chakrabarty, Krishnendu;  Peng, Zebo;  Rezine, Ahmed;  Li, Huawei
收藏  |  浏览/下载:19/0  |  提交时间:2020/12/10
Comparative studies on the adequacy check of parametric measurement error models with auxiliary variable 期刊论文
STATISTICAL PAPERS, 2020, 页码: 29
作者:  Sun, Zhihua;  Luo, Dongshan;  Zhou, Xiaohua;  Zhang, Qingzhao
收藏  |  浏览/下载:13/0  |  提交时间:2020/05/24
Static aeroelastic models with integrated stiffness-contributing shell structures built by additive manufacturing 期刊论文
ENGINEERING STRUCTURES, 2019, 卷号: 187, 页码: 352-361
作者:  Zhu, Weijun;  Miao, Kai;  Li, Dichen
收藏  |  浏览/下载:4/0  |  提交时间:2019/11/19
Thermal and acoustic performance of an integrated automotive thermoelectric generation system 期刊论文
APPLIED THERMAL ENGINEERING, 2019, 卷号: 158
作者:  Wan, QiuShi;  Liu, Xun*;  Gu, Ban;  Bai, WanRong;  Su, ChuQi
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/04
Geophysical survey over molybdenum mines using the newly developed M-TEM system 期刊论文
JOURNAL OF APPLIED GEOPHYSICS, 2018, 卷号: 158, 页码: 65-70
作者:  Di, Qing-yun;  Xue, Guo-qiang;  Lei, Da;  Wang, Zhong-xing;  Zhang, Yi-ming
收藏  |  浏览/下载:95/0  |  提交时间:2018/10/23
Design of Test System for Arc Fault Protection Switch 会议论文
作者:  Su Jingjing;  Xu Zhihong;  Zhang Changkun
收藏  |  浏览/下载:3/0  |  提交时间:2019/11/21
High-speed stereo-digital image correlation using a single color high-speed camera 期刊论文
APPLIED OPTICS, 2018, 卷号: 57, 页码: 9257-9269
作者:  Yu, Liping;  Pan, Bing
收藏  |  浏览/下载:5/0  |  提交时间:2019/12/30
Feedback-based integrated prediction: Defect prediction based on feedback from software testing process 期刊论文
JOURNAL OF SYSTEMS AND SOFTWARE, 2018, 卷号: 143, 页码: 159-171
作者:  Xiao, Peng;  Liu, Bin;  Wang, Shihai
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/30
The mathematical model and novel final test system for wafer-level packaging 期刊论文
IEEE Transactions on Industrial Informatics, 2017, 卷号: 13, 期号: 4, 页码: 1817-1824
作者:  Li, Junhui*;  Tian, Wenya;  Liao, Hailong
收藏  |  浏览/下载:10/0  |  提交时间:2019/12/03


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