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期刊论文 [41]
会议论文 [12]
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Evaluation Method of Heavy-Ion-Induced Single-Event Upset in 3D-Stacked SRAMs
期刊论文
ELECTRONICS, 2020, 卷号: 9, 期号: 8, 页码: 14
作者:
Zhao, Peixiong
;
Liu, Tianqi
;
Cai, Chang
;
He, Ze
;
Li, Dongqing
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2021/12/15
Monte-Carlo simulation
single-event upset
test standard
three-dimensional integrated circuits
ultrahigh-energy heavy ion
Software-Based Self-Testing Using Bounded Model Checking for Out-of-Order Superscalar Processors
期刊论文
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2020, 卷号: 39, 期号: 3, 页码: 714-727
作者:
Zhang, Ying
;
Chakrabarty, Krishnendu
;
Peng, Zebo
;
Rezine, Ahmed
;
Li, Huawei
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2020/12/10
Circuit faults
Built-in self-test
Out of order
Model checking
Integrated circuit modeling
Bounded model checking (BMC)
online testing
out-of-order superscalar processors
software-based self-testing (SBST)
Comparative studies on the adequacy check of parametric measurement error models with auxiliary variable
期刊论文
STATISTICAL PAPERS, 2020, 页码: 29
作者:
Sun, Zhihua
;
Luo, Dongshan
;
Zhou, Xiaohua
;
Zhang, Qingzhao
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2020/05/24
Weighted integrated squared distance test
U-statistic test
Empirical process based test
Power comparisons
Measurement error
Static aeroelastic models with integrated stiffness-contributing shell structures built by additive manufacturing
期刊论文
ENGINEERING STRUCTURES, 2019, 卷号: 187, 页码: 352-361
作者:
Zhu, Weijun
;
Miao, Kai
;
Li, Dichen
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/11/19
Wind tunnel test
Integrated structure
Additive manufacturing
Static aeroelastic models
Thermal and acoustic performance of an integrated automotive thermoelectric generation system
期刊论文
APPLIED THERMAL ENGINEERING, 2019, 卷号: 158
作者:
Wan, QiuShi
;
Liu, Xun*
;
Gu, Ban
;
Bai, WanRong
;
Su, ChuQi
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  |  
浏览/下载:1/0
  |  
提交时间:2019/12/04
Temperature difference
Integrated thermoelectric generator
Acoustic performance
Bench test
Geophysical survey over molybdenum mines using the newly developed M-TEM system
期刊论文
JOURNAL OF APPLIED GEOPHYSICS, 2018, 卷号: 158, 页码: 65-70
作者:
Di, Qing-yun
;
Xue, Guo-qiang
;
Lei, Da
;
Wang, Zhong-xing
;
Zhang, Yi-ming
收藏
  |  
浏览/下载:95/0
  |  
提交时间:2018/10/23
Multi-channel transient electromagnetic (M-TEM) system
Pseudo random binary sequence
Integrated test
Earth impulse response
Design of Test System for Arc Fault Protection Switch
会议论文
作者:
Su Jingjing
;
Xu Zhihong
;
Zhang Changkun
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/11/21
Arc Fault Simulation Devices
Arc Fault
Muti-threading
Integrated Test Circuit
High-speed stereo-digital image correlation using a single color high-speed camera
期刊论文
APPLIED OPTICS, 2018, 卷号: 57, 页码: 9257-9269
作者:
Yu, Liping
;
Pan, Bing
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  |  
浏览/下载:5/0
  |  
提交时间:2019/12/30
CMOS integrated circuits
Color
Cost effectiveness
High speed cameras
Image analysis
Speed
Stereo image processing
Strain measurement
Accuracy and precision
Aluminum panel
Color cameras
Cost effective
Deformation measurements
Digital image correlations
Stationary objects
Vibration test
Displacement measurement
Feedback-based integrated prediction: Defect prediction based on feedback from software testing process
期刊论文
JOURNAL OF SYSTEMS AND SOFTWARE, 2018, 卷号: 143, 页码: 159-171
作者:
Xiao, Peng
;
Liu, Bin
;
Wang, Shihai
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/12/30
Test resource constraints
Software testing
Defect prediction
Feedback control
Integrated prediction
The mathematical model and novel final test system for wafer-level packaging
期刊论文
IEEE Transactions on Industrial Informatics, 2017, 卷号: 13, 期号: 4, 页码: 1817-1824
作者:
Li, Junhui*
;
Tian, Wenya
;
Liao, Hailong
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  |  
浏览/下载:10/0
  |  
提交时间:2019/12/03
Automatic final test
integrated circuit (IC) modeling
mathematical model
measurement techniques
microprobe final test
through-silicon vias
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