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浏览/检索结果: 共2条，第1-2条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420 作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin;  Zhou, Liuru 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Binary alloys  Geometry  Intermetallics  Lead-free solders  Morphology  Polychlorinated biphenyls  Silver compounds  Soldered joints  Tin alloys  Aging time  Compressive strain  Enhanced effects  Growth of intermetallics  Kirkendall void  Mean diameter  Polyhedron shapes  Solder joints   Effect of Filler Wires on Brazing Interface Microstructure and Mechanical Properties of Al/Cu Dissimilar Metals Welding-Brazing Joint 期刊论文 Cailiao Daobao/Materials Review, 2017, 卷号: 31, 期号: 5, 页码: 61-64 作者:  Shi, Yu;  Zhou, Xianglong;  Zhu, Ming;  Gu, Yufen;  Fan, Ding 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Aluminum compounds  Binary alloys  Brazing  Copper alloys  Copper compounds  Dissimilar metals  Filler metals  Fillers  Gas metal arc welding  Gas welding  Intermetallics  Laser beam welding  Mechanical properties  Metals  Microstructure  Tensile strength  Welds  Wire  Brazing interface  Double electrodes  Filler materials  Filler wire  Growth of intermetallics  Intermetallic compound layer  MIG welding  Welding joints