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浏览/检索结果: 共2条，第1-2条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 3, 页码: 2320-2330 作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Zhou, Liuru;  Li, Qinglin 收藏  |  浏览/下载：11/0  |  提交时间：2020/06/16 Additives  Atomic force microscopy  Binary alloys  Chlorine compounds  Copper  Copper compounds  Electron probe microanalysis  Electrons  High resolution transmission electron microscopy  Metallic films  Scanning electron microscopy  Tin alloys  Tin metallography  X ray photoelectron spectroscopy  Crystallographic orientations  Electron back scatter diffraction  Electroplated copper film  Electroplated Cu films  Impurity incorporation  Micro-structural characterization  Microstructural instability  Plating solutions   Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Atomic force microscopy  Coatings  Copper compounds  Electroplating  Gold  Growth rate  Lead-free solders  Metallic films  Scanning electron microscopy  Semiconductor doping  Silver alloys  Silver metallography  Soldering  Substrates  Surface roughness  Ternary alloys  Thermal aging  Tin alloys  Tin compounds  Tin metallography  X ray photoelectron spectroscopy  Benzotriazole(BTA)  Electroplated Cu films  Heterocyclic compound  Interfacial microstructure evolution  Isothermal aging  Kovar substrates  Low concentrations  Soldering process