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CORC

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An observation and explanation of interior cracking at the interface of solder by electromigration 期刊论文
Microelectronics Reliability, 2019, 卷号: Vol.97, 页码: 79-84
作者:  Qizhi Wang;  Qingyi Liu;  Zheng Zhang;  Min Miao;  Yehao Su
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/13
An observation and explanation of interior cracking at the interface of solder by electromigration 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: Vol.97, 页码: 79-84
作者:  Wang, QZ;  Liu, QY;  Zhang, Z;  Miao, M;  Su, YH
收藏  |  浏览/下载：12/0  |  提交时间：2019/12/17
An observation and explanation of interior cracking at the interface of solder by electromigration 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 97, 页码: 79-84
作者:  Wang, Qizhi;  Liu, Qingyi;  Zhang, Zheng;  Miao, Min;  Su, Yehao
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/30
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
作者:  Gao, LY;  Zhang, H;  Li, CF;  Guo, JD;  Liu, ZQ
收藏  |  浏览/下载：32/0  |  提交时间：2018/12/25
Effects of Current Stress for Low Temperature Cu/Sn/Cu Solid-State-Diffusion Bonding 会议论文
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017-01-01
作者:  Cai, Jian;  Wang, Qian;  Wang, Dejun;  Wang, Junqiang;  Wu, Zijian
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09
Influence of Stress on the Electromigration Life of Solder 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 卷号: 7, 页码: 762-767
作者:  Zhang, Zheng;  Liu, Qingyi;  Pan, Xiaoxu;  Wang, Qizhi;  Su, Fei
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30
Reverse Polarity Effect in Cu/Sn-9Zn/Ni Interconnect under High Current Density at High Temperature 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Huang, Mingliang;  Zhang, Zhijie;  Zhao, Ning;  Feng, Xiaofei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Study on Liquid-Solid Electromigration in Cu/Sn-9Zn/Cu Interconnect Using Synchrotron Radiation Real-Time in Situ Imaging Technology 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:  Huang, Mingliang;  Zhang, Zhijie;  Zhao, Ning;  Feng, Xiaofei
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/11
Proportional difference estimate method for bimodal and multimodal failure distributions 期刊论文
ieee电子器件汇刊, 2001
Mu, FC; Tan, CH; Xu, MZ
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/10

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