| Influence of Stress on the Electromigration Life of Solder | |
| Zhang, Zheng; Liu, Qingyi; Pan, Xiaoxu; Wang, Qizhi; Su, Fei | |
| 刊名 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
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| 2017 | |
| 卷号 | 7页码:762-767 |
| 关键词 | Electromigration (EM) mean time to failure (MTTF) microsolder reliability |
| ISSN号 | 2156-3950 |
| DOI | 10.1109/TCPMT.2017.2657229 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE ; EI |
| WOS记录号 | WOS:000401979800013 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5939817 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Zhang, Zheng,Liu, Qingyi,Pan, Xiaoxu,et al. Influence of Stress on the Electromigration Life of Solder[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2017,7:762-767. |
| APA | Zhang, Zheng,Liu, Qingyi,Pan, Xiaoxu,Wang, Qizhi,&Su, Fei.(2017).Influence of Stress on the Electromigration Life of Solder.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,7,762-767. |
| MLA | Zhang, Zheng,et al."Influence of Stress on the Electromigration Life of Solder".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 7(2017):762-767. |
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