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厦门大学 [8]
清华大学 [3]
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华南理工大学 [3]
南华大学 [2]
金属研究所 [2]
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期刊论文 [20]
会议论文 [4]
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会议 [2]
学位论文 [2]
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2019 [2]
2015 [2]
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Obtaining ultra-high throwing power in Cu electroplating of flexible printed circuit by fast consumption of a suppressor
期刊论文
JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2021, 页码: 11
作者:
Wei, Xiang-Fu
;
Zhu, Qing-Sheng
;
Guo, Jing-Dong
;
Shang, Jian-Ku
收藏
  |  
浏览/下载:38/0
  |  
提交时间:2021/11/22
Copper electroplating
Throwing power (TP)
Flexible printed circuit (FPC)
Suppressor
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints
期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:
Yi, Xiong
;
Yi, Guangbin
;
Hu, Xiaowu
;
Li, Qinglin
;
Zhang, Ruhua
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Atomic force microscopy
Coatings
Copper compounds
Electroplating
Gold
Growth rate
Lead-free solders
Metallic films
Scanning electron microscopy
Semiconductor doping
Silver alloys
Silver metallography
Soldering
Substrates
Surface roughness
Ternary alloys
Thermal aging
Tin alloys
Tin compounds
Tin metallography
X ray photoelectron spectroscopy
Benzotriazole(BTA)
Electroplated Cu films
Heterocyclic compound
Interfacial microstructure evolution
Isothermal aging
Kovar substrates
Low concentrations
Soldering process
DTL construction status of China Spallation Neutron Source
期刊论文
ATOMIC ENERGY SCIENCE AND TECHNOLOGY, 2015, 卷号: 49, 页码: 556-559
作者:
Liu
;
Hua-Chang
;
Peng
;
Jun
;
Gong
收藏
  |  
浏览/下载:41/0
  |  
提交时间:2016/04/18
Construction status
Copper electroplating
Drift-tube linac
DTL
Fabrication process
High electrical conductivity
High intensity beam
Spallation neutron sources
Adsorption of Copper(II) from an Wastewater Effluent of Electroplating Industry by Poly(ethyleneimine)-Functionalized Silica
期刊论文
IRANIAN JOURNAL OF CHEMISTRY & CHEMICAL ENGINEERING-INTERNATIONAL ENGLISH EDITION, 2015, 卷号: 34, 页码: 73-81
作者:
Xu, Hongbo
;
Liu, Dan-dan
;
He, Lu
;
Liu, Na
;
Ning, Guiling
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2019/12/09
Copper
Removal
Poly(ethyleneimine)
Adsorption
Electroplating wastewater
强化H2O2氧化水中Cu(CN)32-的机制与方法
学位论文
博士, 北京: 中国科学院研究生院, 2014
作者:
陈发源
收藏
  |  
浏览/下载:193/0
  |  
提交时间:2016/08/16
电镀废水
铜氰络合物
电化学
H2O2氧化
电芬顿,Electroplating wastewater
Copper cyanide complex
Hydrogen peroxide oxidation
Electrochemical Fenton
Encapsulation of copper-based phase change materials for high temperature thermal energy storage
期刊论文
SOLAR ENERGY MATERIALS AND SOLAR CELLS, 2014, 卷号: 128, 期号: SEP., 页码: 131-137
作者:
Zhang, Guocai
;
Li, Jianqiang
;
Chen, Yunfa
;
Xiang, Heng
;
Ma, Bingqian
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2014/09/30
Phase change materials
Encapsulation
Electroplating
Copper
Chromium-nickel layer
Charge-discharge cycle
n Recovery of Copper by Electrodeposition Method from Electroplating Wastewater
会议论文
2nd International Conference on Mechanical Engineering, Civil Engineering and Material Engineering (MECEM), Wuhan, PEOPLES R CHINA, SEP 27-28, 2014
作者:
Fan, Shuai*
;
Wang, Jingsong
;
Guo, Qingwei
;
Zhang, Weiming
;
Sun, Ping
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/27
electroplating wastewater
Electrodeposition
copper recovery
electrolytic parameters
n Recovery of Copper by Electrodeposition Method from Electroplating Wastewater
会议论文
2nd International Conference on Mechanical Engineering, Civil Engineering and Material Engineering (MECEM), Wuhan, PEOPLES R CHINA, SEP 27-28, 2014
作者:
Fan, Shuai*
;
Wang, Jingsong
;
Guo, Qingwei
;
Zhang, Weiming
;
Sun, Ping
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/27
electroplating wastewater
Electrodeposition
copper recovery
electrolytic parameters
Multi-scale porous copper foams as wick structures
期刊论文
Materials Letters, 2013, 卷号: 106, 页码: 360-362
作者:
Hongtao Zhang
;
Qinglin Pan
;
Hongyan Zhang
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/03
Porous materials
Porosity
Microstructure
Electroplating
Copper
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