×
验证码:
换一张
忘记密码?
记住我
CORC
首页
科研机构
检索
知识图谱
申请加入
托管服务
登录
注册
在结果中检索
科研机构
大连理工大学 [43]
清华大学 [34]
上海大学 [23]
兰州理工大学 [15]
厦门大学 [10]
西安交通大学 [9]
更多...
内容类型
期刊论文 [120]
会议论文 [34]
其他 [2]
学位论文 [1]
发表日期
2019 [10]
2018 [9]
2017 [9]
2016 [7]
2015 [9]
2014 [10]
更多...
×
知识图谱
CORC
开始提交
已提交作品
待认领作品
已认领作品
未提交全文
收藏管理
QQ客服
官方微博
反馈留言
浏览/检索结果:
共157条,第1-10条
帮助
已选(
0
)
清除
条数/页:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
排序方式:
请选择
发表日期升序
发表日期降序
作者升序
作者降序
提交时间升序
提交时间降序
题名升序
题名降序
Effect of geometry error on accuracy of large-diameter pads used for CMP dressing
期刊论文
International Journal of Advanced Manufacturing Technology, 2019, 卷号: 100, 页码: 1505-1520
作者:
Ban, X.X.
;
Zhao, H.Y.
;
Zhao, S.J.
;
Xie, R.Q.
;
Gu, Y.W.
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2019/11/19
Chemical mechanical polishing(CMP)
Geometry errors
Measured values
Polishing pads
Polyurethane pads
Profile accuracies
Spherical surface
Surface profiles
Insights into the atomistic behavior in diamond chemical mechanical polishing with center dot OH environment using ReaxFF molecular dynamics simulation
期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2019, 卷号: 166, 页码: 136-142
作者:
Shi, Zhuoying
;
Jin, Zhuji
;
Guo, Xiaoguang
;
Yuan, Song
;
Guo, Jiang
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/02
Diamond
Chemical mechanical polishing
Removal mechanism
Molecular dynamics simulation
ReaxFF
Precision Fabrication of Thin Copper Substrate by Double-sided Lapping and Chemical Mechanical Polishing
期刊论文
JOURNAL OF MANUFACTURING PROCESSES, 2019, 卷号: 44, 页码: 47-54
作者:
Pan, Bo
;
Kang, Renke
;
Guo, Jiang
;
Fu, Haiyang
;
Du, Dongxing
收藏
  |  
浏览/下载:44/0
  |  
提交时间:2019/12/02
Double-sided lapping
Chemical mechanical polishing
Flatness
Surface integrity
Residual stress
Effect of cupric ion concentration on the etching behavior of copper in Electrogenerated Chemical Polishing (EGCP)
期刊论文
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2019, 卷号: 55, 页码: 70-76
作者:
Wang, Ke
;
Yan, Ying
;
Zhou, Ping
;
Shi, Kang
;
Guo, Dongming
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/12/02
Electrogenerated chemical polishing
Roughness
Cupric ions
Apparent activation energy
Redox potential
Photochemically combined mechanical polishing of N-type gallium nitride wafer in high efficiency
期刊论文
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2019, 卷号: 55, 页码: 14-21
作者:
Ou, Li -Wei
;
Wang, Ya-Hui
;
Hu, Hui-Qing
;
Zhang, Liang-Liang
;
Dong, Zhi-Gang
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/12/02
Gallium nitride
Chemical mechanical polishing
Photo-assisted oxidation
Potassium persulfate
Material removal rate
A novel chemical mechanical polishing slurry for yttrium aluminum garnet crystal
期刊论文
APPLIED SURFACE SCIENCE, 2019, 卷号: 496
作者:
Zhang, Zili
;
Jin, Zhuji
;
Guo, Jiang
;
Han, Xiaolong
;
Mu, Qing
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2019/12/02
Yttrium aluminum garnet
Chemical mechanical polishing
Surface roughness
Material removal rate
Reaction mechanism
Preparation of ellipsoidal rod-shaped silica nanocomposite abrasives by Chromium ion/PEG200 induced method for sapphire substrates chemical mechanical polishing
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 777, 页码: 1294-1303
作者:
Dong, Yue[1]
;
Lei, Hong[2]
;
Liu, Wenqing[3]
;
Chen, Yi[4]
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2019/04/22
Ellipsoidal rod-shaped silica nanocomposite abrasives
Chemical mechanical polishing
Polishing mechanism
Sapphire substrates
Highly efficient removal of sapphire by composite nanoabrasive with novel inorganic polyelectrolyte as a binder
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 782, 页码: 709-715
作者:
Wang, Tianxian[1]
;
Lei, Hong[2]
;
Dong, Yue[3]
;
Xu, Lei[4]
;
Dai, Sanwei[5]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/22
Novel inorganic polyelectrolyte
Composite abrasive
Chemical mechanical polishing
High material removal rate
Mechanism
Sapphire
Silica Nano-particle Anneal Treatment and Its Effect on Chemical Mechanical Polishing
期刊论文
Journal of Electrical Engineering & Technology, 2019, 卷号: Vol.14 No.1, 页码: 355-361
作者:
Shibin Lu
;
Ying Meng
;
Haibo Wang
;
Junning Chen
;
Feifei Wang
收藏
  |  
浏览/下载:140/0
  |  
提交时间:2019/04/24
Silicon
Chemical mechanical polishing
Colloid silica
Nano-indentation
Effect of cupric ion concentration on the etching behavior of copper in Electrogenerated Chemical Polishing
期刊论文
Precision Engineering, 2019, 卷号: Vol.55, 页码: 70-76
作者:
Ke Wang
;
Ying Yan
;
Ping Zhou
;
Kang Shi
;
Dongming Guo
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/13
Electrogenerated
chemical
polishing
Roughness
Cupric
ions
Apparent
activation
energy
Redox
potential
©版权所有 ©2017 CSpace - Powered by
CSpace