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CORC

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Effect of geometry error on accuracy of large-diameter pads used for CMP dressing 期刊论文
International Journal of Advanced Manufacturing Technology, 2019, 卷号: 100, 页码: 1505-1520
作者:  Ban, X.X.;  Zhao, H.Y.;  Zhao, S.J.;  Xie, R.Q.;  Gu, Y.W.
收藏  |  浏览/下载：14/0  |  提交时间：2019/11/19
Atomistic mechanisms of Cu CMP in aqueous H2O2: Molecular dynamics simulations using ReaxFF reactive force field 期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2018, 卷号: 155, 页码: 476-482
作者:  Guo, Xiaoguang;  Wang, Xiaoli;  Jin, Zhuji;  Kang, Renke
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Improvement and application of pad conditioning accuracy in chemical mechanical polishing 期刊论文
Optical Engineering, 2018, 卷号: 57
作者:  Ban, Xinxing;  Zhao, Huiying;  Zhu, Xueliang;  Zhao, Shijie;  Xie, Ruiqing
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/26
Material removal model of ultrasonic elliptical vibration-assisted chemical mechanical polishing for hard and brittle materials 期刊论文
International Journal of Advanced Manufacturing Technology, 2017, 卷号: 92, 期号: 1-4, 页码: 81-99
作者:  Liu, Defu*;  Yan, Riming;  Chen, Tao
收藏  |  浏览/下载：12/0  |  提交时间：2019/12/03
CMP behavior of alumina/metatitanic acid core-shell abrasives on sapphire substrates 期刊论文
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2017, 卷号: 50, 页码: 263-268
作者:  Wang, Xin[1];  Lei, Hong[2];  Chen, Ruling[3]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/24
Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers 期刊论文
APPLIED SURFACE SCIENCE, 2017, 卷号: 413, 页码: 16-26
作者:  Liu, Tingting[1];  Lei, Hong[2]
收藏  |  浏览/下载：9/0  |  提交时间：2019/04/24
Preparation of Mg-Doped Colloidal Silica Abrasives and Their Chemical Mechanical Polishing Performances on Sapphire 期刊论文
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2016, 卷号: 16, 页码: 9951-9957
作者:  Ma, Pan[1];  Lei, Hong[2];  Chen, Ruling[3]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/26
Process parameters optimisation for Si3N4 in chemical-mechanical polishing via Taguchi technique 期刊论文
International Journal of Nanomanufacturing, 2016, 卷号: Vol.12 No.2, 页码: 143-153
作者:  Wan, Lin-Lin;  Deng, Zhao-Hui;  Wang, Chao-Deng;  Liu, Wei;  Liu, Zhi-Jian
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/31
Effects of Polishing Parameters on Evolution of Different Wafer Patterns During Cu CMP 期刊论文
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2015, 卷号: 28, 期号: 1, 页码: 106-116
作者:  Wu, Lixiao;  Yan, Changfeng
收藏  |  浏览/下载：15/0  |  提交时间：2019/11/15
Effects of polishing parameters on evolution of different wafer patterns during Cu CMP 期刊论文
IEEE Transactions on Semiconductor Manufacturing, 2015, 卷号: 28, 期号: 1, 页码: 106-116
作者:  Wu, Lixiao;  Yan, Changfeng
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14

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