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浏览/检索结果: 共15条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序作者升序作者降序提交时间升序提交时间降序题名升序题名降序 Enhanced Electrochemical N-2 Reduction to NH3 on Reduced Graphene Oxide by Tannic Acid Modification 期刊论文 2019, 卷号: 7, 期号: 17, 页码: 14368-14372 作者:  Song, Yanyan[1];  Wang, Ting[2,3];  Sun, Junwei[1];  Wang, Zhichao[1];  Luo, Yonglan[2] 收藏  |  浏览/下载：20/0  |  提交时间：2019/12/16 Structure-based design of competitive ligands to target Spon2 in gastric cancer: An integration of molecular modeling and in vitro assay 期刊论文 2017, 卷号: 74, 页码: 115 作者:  Xu, Zhenglei[1];  Yu, Zhichao[1];  Nai, Shumei[1];  Shi, Ruiyue[1];  Tang, Qinhong[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/10 PREVENTING AGING OF ELECTRICALLY CONDUCTIVE ADHESIVES ON METAL SUBSTRATE USING GRAPHENE BASED BARRIER 会议论文 China Semiconductor Technology International Conference (CSTIC), 2016-01-01 作者:  Ye, Hui[1];  Huang, Shirong[2];  Yuan, Zhichao[3];  Lu, Xiuzhen[4];  Jeppson, Kjell[5] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/26 2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS 会议论文 China Semiconductor Technology International Conference (CSTIC), 2016-01-01 作者:  Zhang, Yong[1];  Huang, Shirong[2];  Wang, Nan[3];  Bao, Jie[4];  Sun, Shuangxi[5] 收藏  |  浏览/下载：11/0  |  提交时间：2019/04/26 Influence of substrate on electrical conductivity of isotropic conductive adhesive 会议论文 2011 International Symposium on Advanced Packaging Materials, APM 2011, 2011-10-25 作者:  Hu, Zhili[1];  Du, Wenhui[2];  Yue, Cong[3];  Ye, Lilei[4];  Yuan, Zhichao[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30 A Highly Conductive Bimodal Isotropic Conductive Adhesive and Its Reliability 会议论文 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13 作者:  Li, Dongsheng[1];  Cui, Huiwang[2];  Chen, Si[3];  Fan, Qiong[4];  Yuan, Zhichao[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30 The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives 会议论文 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13 作者:  Fan, Qiong[1];  Cui, Huiwang[2];  Fu, Chune[3];  Li, Dongsheng[4];  Tang, Xin[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30 Study on the Reliability of Fast Curing Isotropic Conductive Adhesive 会议论文 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13 作者:  Du, Wenhui[1];  Cui, Huiwang[2];  Chen, Si[3];  Yuan, Zhichao[4];  Ye, Lilei[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/30 Study into High Temperature Reliability of Isotropic Conductive Adhesive 会议论文 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011-08-08 作者:  Du, Wenhui[1];  Cui, Huiwang[2];  Chen, Si[3];  Yuan, Zhichao[4];  Ye, Lilei[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30 Study into the Application of Single-Wall Carbon Nanotubes in Isotropic Conductive Adhesives 会议论文 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011-08-08 作者:  Li, Dongsheng[1];  Cui, Huiwang[2];  Fan, Qiong[3];  Duan, Yajun[4];  Yuan, Zhichao[5] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/30 SCNTs  ICAs  mechanical properties  electrical properties  thermal and humid properties