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科研机构
上海大学 [10]
华南理工大学 [3]
暨南大学 [1]
成都中医药大学 [1]
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会议论文 [13]
期刊论文 [2]
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2019 [1]
2017 [1]
2016 [2]
2011 [8]
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Enhanced Electrochemical N-2 Reduction to NH3 on Reduced Graphene Oxide by Tannic Acid Modification
期刊论文
2019, 卷号: 7, 期号: 17, 页码: 14368-14372
作者:
Song, Yanyan[1]
;
Wang, Ting[2,3]
;
Sun, Junwei[1]
;
Wang, Zhichao[1]
;
Luo, Yonglan[2]
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2019/12/16
Structure-based design of competitive ligands to target Spon2 in gastric cancer: An integration of molecular modeling and in vitro assay
期刊论文
2017, 卷号: 74, 页码: 115
作者:
Xu, Zhenglei[1]
;
Yu, Zhichao[1]
;
Nai, Shumei[1]
;
Shi, Ruiyue[1]
;
Tang, Qinhong[1]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/10
PREVENTING AGING OF ELECTRICALLY CONDUCTIVE ADHESIVES ON METAL SUBSTRATE USING GRAPHENE BASED BARRIER
会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:
Ye, Hui[1]
;
Huang, Shirong[2]
;
Yuan, Zhichao[3]
;
Lu, Xiuzhen[4]
;
Jeppson, Kjell[5]
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  |  
浏览/下载:5/0
  |  
提交时间:2019/04/26
2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS
会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:
Zhang, Yong[1]
;
Huang, Shirong[2]
;
Wang, Nan[3]
;
Bao, Jie[4]
;
Sun, Shuangxi[5]
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2019/04/26
Influence of substrate on electrical conductivity of isotropic conductive adhesive
会议论文
2011 International Symposium on Advanced Packaging Materials, APM 2011, 2011-10-25
作者:
Hu, Zhili[1]
;
Du, Wenhui[2]
;
Yue, Cong[3]
;
Ye, Lilei[4]
;
Yuan, Zhichao[5]
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  |  
浏览/下载:4/0
  |  
提交时间:2019/04/30
A Highly Conductive Bimodal Isotropic Conductive Adhesive and Its Reliability
会议论文
CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13
作者:
Li, Dongsheng[1]
;
Cui, Huiwang[2]
;
Chen, Si[3]
;
Fan, Qiong[4]
;
Yuan, Zhichao[5]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/30
The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives
会议论文
CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13
作者:
Fan, Qiong[1]
;
Cui, Huiwang[2]
;
Fu, Chune[3]
;
Li, Dongsheng[4]
;
Tang, Xin[5]
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  |  
浏览/下载:4/0
  |  
提交时间:2019/04/30
Study on the Reliability of Fast Curing Isotropic Conductive Adhesive
会议论文
CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13
作者:
Du, Wenhui[1]
;
Cui, Huiwang[2]
;
Chen, Si[3]
;
Yuan, Zhichao[4]
;
Ye, Lilei[5]
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  |  
浏览/下载:6/0
  |  
提交时间:2019/04/30
Study into High Temperature Reliability of Isotropic Conductive Adhesive
会议论文
2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011-08-08
作者:
Du, Wenhui[1]
;
Cui, Huiwang[2]
;
Chen, Si[3]
;
Yuan, Zhichao[4]
;
Ye, Lilei[5]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/30
Study into the Application of Single-Wall Carbon Nanotubes in Isotropic Conductive Adhesives
会议论文
2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011-08-08
作者:
Li, Dongsheng[1]
;
Cui, Huiwang[2]
;
Fan, Qiong[3]
;
Duan, Yajun[4]
;
Yuan, Zhichao[5]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/30
SCNTs
ICAs
mechanical properties
electrical properties
thermal and humid properties
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