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浏览/检索结果: 共6条，第1-6条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Load Distribution Research on Flexible Bearing in Harmonic Drive 会议论文 Mechanisms and Machine Science, 2017-10-13 作者:  Tian, Lin[1];  Jiang, Yi[2];  Wang, Yazhen[3];  Tong, Qun[4];  Su, Dashi[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/22 harmonic drive  flexible bearing  load distribution  contact stress   Thermodynamic Research on Flexible Bearing in Harmonic Drive 会议论文 Mechanisms and Machine Science, 2017-10-13 作者:  Huang, Bin[1];  Wang, Yazhen[2];  Zhao, Kun[3];  Su, Dashi[4];  Song, Li[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/22 flexible bearing  friction torque  steady state thermal analysis  temperature distribution   Micro channel structure with strengthened rough surface in an ethanol reforming hydrogen generator (EI收录) 会议论文 Proceedings of the International Conference on Integration and Commercialization of Micro and Nanosystems 2007, Sanya, Hainan, China, January 10, 2007 - January 13, 2007 作者:  Su, Dashi[1,2];  Tang, Yong[1];  Pan, Mingqiang[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/17 Ethanol  Fuel cells  Hydrogen production  Reforming reactions  Surface roughness  Surface structure   Enhanced boiling microstructures applied to microelectronics cooling (EI收录) 会议论文 2009 International Conference on Measuring Technology and Mechatronics Automation, ICMTMA 2009, Zhangjiajie, Hunan, China, April 11, 2009 - April 12, 2009 作者:  Dashi, Su[1];  Yong, Tang[2];  Biao, Tang[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/17 Capillary flow  Condenser tubes  Evaporators  Heat exchangers  Heat flux  Heat transfer  Mechatronics  Microelectronics  Microstructure  Nucleate boiling  Siphons   A new kind of microstructures applied to closed loop thermosyphons (EI收录) 会议论文 2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009, Changchun, China, August 9, 2009 - August 12, 2009 作者:  Su, Dashi[1];  Liu, Yajun[2];  Zhou, Wei[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/17 Capillary flow  Condenser tubes  Heat exchangers  Heat flux  Heat resistance  Heat transfer  Mechatronics  Microstructure  Siphons   Enhanced Boiling Microstructures Applied to Microelectronics Cooling (CPCI-S收录) 会议论文 2009 INTERNATIONAL CONFERENCE ON MEASURING TECHNOLOGY AND MECHATRONICS AUTOMATION, VOL III 作者:  Su Dashi[1];  Tang Yong[2];  Tang Biao[2] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/17 Enhanced boiling  Thermosyphon  Two-phase heat transfer  Microstructure