QQ客服 官方微博 反馈留言

	Enhanced boiling microstructures applied to microelectronics cooling (EI收录)
	Dashi, Su[1]; Yong, Tang[2]; Biao, Tang[2]
会议名称	2009 International Conference on Measuring Technology and Mechatronics Automation, ICMTMA 2009
会议日期	April 11, 2009 - April 12, 2009
会议地点	Zhangjiajie, Hunan, China
关键词	Capillary flow Condenser tubes Evaporators Heat exchangers Heat flux Heat transfer Mechatronics Microelectronics Microstructure Nucleate boiling Siphons
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2078591
专题	华南理工大学
作者单位	1.[1] School Of Mechanical Engineering, Shaoguan University, Shaoguan, China 2.[2] School of Mechanical Engineering, South China University of Technology, Guangzhou, China
推荐引用方式 GB/T 7714	Dashi, Su[1],Yong, Tang[2],Biao, Tang[2]. Enhanced boiling microstructures applied to microelectronics cooling (EI收录)[C]. 见:2009 International Conference on Measuring Technology and Mechatronics Automation, ICMTMA 2009. Zhangjiajie, Hunan, China. April 11, 2009 - April 12, 2009.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。